公开(公告)号：US20150306382A1

公开(公告)日：2015-10-29

申请号：US14263241

申请日：2014-04-28

Applicant: Medtronic, Inc.

Inventor： Bushan K. Purushothaman ,  Kenneth C. Gardeski ,  Suping Lyu ,  Yaling Fan ,  Peter M. Seiler

IPC: A61N1/08 ,  A61N1/05

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/086

Abstract: Implantable medical leads include a conductive interconnect within a high frequency shunt that dissipates high frequency current. The conductive interconnect provides an elasticity that allows a drive shaft to rotate and translate during implantation of the lead while the conductive interconnect maintains physical contact with the drive shaft and with a shunt electrode before, during, and after the implantation. The conductive interconnect may provide a low friction that presents a smooth rotation and translation of the drive shaft to provide an acceptable tactile feedback during implantation. The conductive interconnect also provides a high electrical conductivity so that a substantial amount of high frequency current flows through the conductive interconnect to the shunt electrode. The conductive interconnect may include a polymer filler that partially penetrates into the interstitial spaces of the conductive interconnect to assist in maintaining the physical integrity of the conductive interconnect.

Abstract translation: 可植入医疗引线包括高频分流器内的导电互连，消散高频电流。 导电互连提供弹性，其允许驱动轴在引线注入期间旋转和平移，而导电互连在植入之前，期间和之后与驱动轴和分流电极保持物理接触。 导电互连可以提供低摩擦，其提供驱动轴的平滑旋转和平移，以在植入期间提供可接受的触觉反馈。 导电互连还提供高导电性，使得大量的高频电流流过导电互连到分流电极。 导电互连可以包括部分地渗透到导电互连的间隙空间中以有助于维持导电互连的物理完整性的聚合物填料。