公开(公告)号：US20230369244A1

公开(公告)日：2023-11-16

申请号：US17742784

申请日：2022-05-12

Applicant: Mellanox Technologies Ltd.

Inventor： Allan GREEN-PETERSEN ,  Kasper Andersen ,  Henrik Ahrendt ,  Thomas Roager

IPC: H01L23/00 ,  H01L23/58 ,  G01R31/26

CPC classification number: H01L23/562 ,  G01R31/2601 ,  H01L23/564 ,  H01L23/585

Abstract: A semiconductor device may include a semiconductor substrate, a wire placed along at least a portion of a perimeter of the semiconductor substrate, and processing circuitry connected to the wire, the processing circuitry to, based on a signal from the wire, determine whether or not the semiconductor device is damaged.