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公开(公告)号:US11615576B2
公开(公告)日:2023-03-28
申请号:US17497485
申请日:2021-10-08
Applicant: Meta Platforms Technologies, LLC
Abstract: This disclosure describes efficient communication of surface texture data between system on a chip (SOC) integrated circuits. An example system includes a first integrated circuit and a second integrated circuit communicatively coupled to the first integrated circuit by a video communication interface. The first integrated generates a superframe in a video frame of the video communication interface for transmission to the second integrated circuit. The superframe includes multiple subframe payloads that carry surface texture data to be updated in the frame and corresponding subframe headers that include parameters of the subframe payloads. The second integrated circuit includes a direct access memory (DMA) controller. The DMA upon receipt of the superframe, writes the surface texture data within each of the subframe payloads directly to an allocated location in memory based on the parameters included in the corresponding one of the subframe headers.