公开(公告)号：US11710514B2

公开(公告)日：2023-07-25

申请号：US17493501

申请日：2021-10-04

Applicant: Micron Technology, Inc.

Inventor： Christopher D. Wieduwilt ,  Lawrence D. Smith ,  James S. Rehmeyer

IPC: G11C11/406 ,  G11C17/16 ,  G11C11/4076

CPC classification number: G11C11/40622 ,  G11C11/4076 ,  G11C11/40615 ,  G11C17/16

Abstract: First signaling indicative of instructions to enter a self-refresh (SREF) mode can be received concurrently by a plurality of memory dies. Responsive to a memory die of the plurality of memory dies entering the SREF mode, self-refreshing of memory banks of the memory die can be delayed, at the memory die and based on fuse states of an array of fuses of the memory die, an amount of time relative to receipt of the signaling by the memory die. Delaying self-refreshing of memory banks of memory dies in a staggered, or asynchronous, manner can evenly distribute power consumption of the memory dies so that the likelihood of an associated power spike is reduced or eliminated.

公开(公告)号：US11948660B2

公开(公告)日：2024-04-02

申请号：US17381057

申请日：2021-07-20

Applicant: Micron Technology, Inc.

Inventor： Christopher G. Wieduwilt ,  Lawrence D. Smith ,  James S. Rehmeyer

IPC: G11C7/22 ,  G11C7/10 ,  G11C17/16

CPC classification number: G11C7/222 ,  G11C7/106 ,  G11C7/1063 ,  G11C7/1087 ,  G11C7/109 ,  G11C17/16

Abstract: Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.

公开(公告)号：US20230026202A1

公开(公告)日：2023-01-26

申请号：US17381057

申请日：2021-07-20

Applicant: Micron Technology, Inc.

Inventor： Christopher G. Wieduwilt ,  Lawrence D. Smith ,  James S. Rehmeyer

IPC: G11C7/22 ,  G11C7/10 ,  G11C17/16

Abstract: Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.

公开(公告)号：US20240233791A1

公开(公告)日：2024-07-11

申请号：US18615399

申请日：2024-03-25

Applicant: Micron Technology, Inc.

Inventor： Christopher G. Wieduwilt ,  Lawrence D. Smith ,  James S. Rehmeyer

IPC: G11C7/22 ,  G11C7/10 ,  G11C17/16

CPC classification number: G11C7/222 ,  G11C7/106 ,  G11C7/1063 ,  G11C7/1087 ,  G11C7/109 ,  G11C17/16

Abstract: Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.