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公开(公告)号：US11569197B2
公开(公告)日：2023-01-31
申请号：US16478218
申请日：2018-02-02
发明人： Minoru Egusa , Shingo Sudo , Kazuyuki Hashimoto , Erubi Suzuki
摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.
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公开(公告)号：US11217514B2
公开(公告)日：2022-01-04
申请号：US16982663
申请日：2019-04-19
发明人： Takamasa Iwai , Shingo Sudo , Yuichiro Suzuki
IPC分类号： H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31 , H02P27/08
摘要： In a power semiconductor device, power semiconductor elements are mounted on a large die pad and the like. The large die pad is joined to a power lead via a lead stepped portion. The large die pad has a first end portion and a second end portion located with a distance therebetween in the X axis direction. In the Y axis direction, the lead stepped portion is joined to the first end portion side relative to a central line between the first end portion and the second end portion. The large die pad is inclined such that a distance between the large die pad and the first main surface of the molding resin is longer from the first end portion toward the second end portion.
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公开(公告)号：US11631653B2
公开(公告)日：2023-04-18
申请号：US16478218
申请日：2018-02-02
发明人： Minoru Egusa , Shingo Sudo , Kazuyuki Hashimoto , Erubi Suzuki
摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.
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