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公开(公告)号：US20210134686A1
公开(公告)日：2021-05-06
申请号：US16993917
申请日：2020-08-14
摘要： A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.
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公开(公告)号：US10388581B2
公开(公告)日：2019-08-20
申请号：US15959353
申请日：2018-04-23
IPC分类号： H01L23/48 , H01L23/055 , H01L23/31 , H01R12/58 , H01L23/00
摘要： A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.
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公开(公告)号：US11631653B2
公开(公告)日：2023-04-18
申请号：US16478218
申请日：2018-02-02
发明人： Minoru Egusa , Shingo Sudo , Kazuyuki Hashimoto , Erubi Suzuki
摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.
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公开(公告)号：US09640453B2
公开(公告)日：2017-05-02
申请号：US14655962
申请日：2014-02-13
发明人： Minoru Egusa , Kazuyoshi Shige
IPC分类号： H01L23/24 , H01L23/053 , H01L25/07 , H01L25/18 , H01R12/58 , H01R13/405 , H01L23/00
CPC分类号： H01L23/053 , H01L23/24 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2224/48101 , H01L2224/48106 , H01L2224/48137 , H01L2224/48227 , H01L2224/48229 , H01L2924/00014 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01R4/48 , H01R12/585 , H01R13/05 , H01R13/405 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/2076
摘要： This invention is provided with: a circuit board which is placed in a package and in which an electric circuit including a power semiconductor element is formed; and a plurality of press-fit terminals each having a wire-bond portion electrically connected in the package to the electric circuit, a press-fit portion for making electrical connection with an apparatus to be connected, and a body portion whose one end portion continuous to the wire bond portion is internally fastened to the package and whose other end portion supports the press-fit portion so as to place the press-fit portion away from the package; wherein in each of the plurality of press-fit terminals, at a portion in the body portion exposed from the package, there is formed a constriction portion that is constricted from both sides in a direction perpendicular to the center line, so as to leave a portion around the center line.
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公开(公告)号：US11569197B2
公开(公告)日：2023-01-31
申请号：US16478218
申请日：2018-02-02
发明人： Minoru Egusa , Shingo Sudo , Kazuyuki Hashimoto , Erubi Suzuki
摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.
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公开(公告)号：US09979105B2
公开(公告)日：2018-05-22
申请号：US15145056
申请日：2016-05-03
IPC分类号： H01R12/58 , H01L23/053
CPC分类号： H01R12/585 , H01L23/053 , H01L2224/48137 , H01L2224/73265 , H01L2924/19107
摘要： A power semiconductor device includes: an outer case; at least one press-fit terminal buried in a top surface of the outer case; and a plurality of supporting portions formed so as to protrude from the top surface of the outer case. A top end of the press-fit terminal protrudes more than top surfaces of the supporting portions from the top surface of the outer case.
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公开(公告)号：US09887142B2
公开(公告)日：2018-02-06
申请号：US15463134
申请日：2017-03-20
发明人： Minoru Egusa , Kazuyoshi Shige
IPC分类号： H01L23/24 , H01L23/053 , H01L25/07 , H01L25/18 , H01R12/58 , H01R13/405 , H01R4/48 , H01R13/05 , H01L23/00
CPC分类号： H01L23/053 , H01L23/24 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2224/48101 , H01L2224/48106 , H01L2224/48137 , H01L2224/48227 , H01L2224/48229 , H01L2924/00014 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01R4/48 , H01R12/585 , H01R13/05 , H01R13/405 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/2076
摘要： This invention is provided with: a circuit board which is placed in a package and in which an electric circuit including a power semiconductor element is formed; and a plurality of press-fit terminals each having a wire-bond portion electrically connected in the package to the electric circuit, a press-fit portion for making electrical connection with an apparatus to be connected, and a body portion whose one end portion continuous to the wire bond portion is internally fastened to the package and whose other end portion supports the press-fit portion so as to place the press-fit portion away from the package; wherein in each of the plurality of press-fit terminals, at a portion in the body portion exposed from the package, there is formed a constriction portion that is constricted from both sides in a direction perpendicular to the center line, so as to leave a portion around the center line.
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公开(公告)号：US20170194223A1
公开(公告)日：2017-07-06
申请号：US15463134
申请日：2017-03-20
发明人： Minoru Egusa , Kazuyoshi Shige
CPC分类号： H01L23/053 , H01L23/24 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2224/48101 , H01L2224/48106 , H01L2224/48137 , H01L2224/48227 , H01L2224/48229 , H01L2924/00014 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01R4/48 , H01R12/585 , H01R13/05 , H01R13/405 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/2076
摘要： This invention is provided with: a circuit board which is placed in a package and in which an electric circuit including a power semiconductor element is formed; and a plurality of press-fit terminals each having a wire-bond portion electrically connected in the package to the electric circuit, a press-fit portion for making electrical connection with an apparatus to be connected, and a body portion whose one end portion continuous to the wire bond portion is internally fastened to the package and whose other end portion supports the press-fit portion so as to place the press-fit portion away from the package; wherein in each of the plurality of press-fit terminals, at a portion in the body portion exposed from the package, there is formed a constriction portion that is constricted from both sides in a direction perpendicular to the center line, so as to leave a portion around the center line.
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