SYSTEM FOR A SINGLE-LAYER SENSOR HAVING REDUCED NUMBER OF INTERCONNECT PADS FOR THE INTERCONNECT PERIPHERY OF THE SENSOR PANEL
    1.
    发明申请
    SYSTEM FOR A SINGLE-LAYER SENSOR HAVING REDUCED NUMBER OF INTERCONNECT PADS FOR THE INTERCONNECT PERIPHERY OF THE SENSOR PANEL 审中-公开
    单层传感器系统,具有传感器面板互连周边连接件数量减少的单层传感器

    公开(公告)号:US20130100041A1

    公开(公告)日:2013-04-25

    申请号:US13279139

    申请日:2011-10-21

    IPC分类号: G06F3/041

    摘要: The structure disclosed reduces the number of bonding pads and interconnect traces in the opaque portion of a single-layer touch panel. By sharing and multiplexing the bonding pads in the opaque portion of panel, half as many pads are needed to provide the interconnection bases for the traces in the opaque portion of the panel that extend to the control electronics subsystem. Further, by connecting the ground plane structures that are adjacent to each TCO column electrode, all ground planes are made part of a common ground-plane electrode. That single common ground-plane electrode can be connected to the appropriate trace and control electronic subsystem using a single pad, rather than several individual ground-plane pads.

    摘要翻译: 所公开的结构减少了单层触摸面板的不透明部分中的接合焊盘和互连迹线的数量。 通过共享和复用面板不透明部分中的接合焊盘,需要一半的焊盘来为扩展到控制电子子系统的面板的不透明部分中的迹线提供互连基座。 此外,通过连接与每个TCO列电极相邻的接地平面结构,所有接地平面被制成公共接地平面电极的一部分。 该单个公共接地平面电极可以使用单个焊盘而不是几个单独的接地平面焊盘连接到适当的跟踪和控制电子子系统。