摘要:
The structure disclosed reduces the number of bonding pads and interconnect traces in the opaque portion of a single-layer touch panel. By sharing and multiplexing the bonding pads in the opaque portion of panel, half as many pads are needed to provide the interconnection bases for the traces in the opaque portion of the panel that extend to the control electronics subsystem. Further, by connecting the ground plane structures that are adjacent to each TCO column electrode, all ground planes are made part of a common ground-plane electrode. That single common ground-plane electrode can be connected to the appropriate trace and control electronic subsystem using a single pad, rather than several individual ground-plane pads.