公开(公告)号：US20170243849A1

公开(公告)日：2017-08-24

申请号：US15519719

申请日：2015-10-22

申请人： NAMICS CORPORATION

发明人： Koji SASAKI ,  Noritsuka MIZUMURA

IPC分类号： H01L23/00 ,  C08K3/08 ,  H01B1/22 ,  C09J167/00 ,  C09J11/06 ,  C09J9/02 ,  C08L67/00

摘要： A conductive composition, which can form bonded portions and is capable of maintaining a thickness of the bonded portions and bonding strength, and which includes: (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent, and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, determined by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C.

公开(公告)号：US20180002576A1

公开(公告)日：2018-01-04

申请号：US15548614

申请日：2016-02-01

申请人： NAMICS CORPORATION

发明人： Koji SASAKI ,  Hiroki MARUYAMA

IPC分类号： C09J9/02 ,  C09J11/06 ,  C09J1/00 ,  H01L21/52 ,  H01B1/22

摘要： A heat conductive paste including silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5, an aliphatic primary amine and a compound having at least one phosphoric acid group. The heat conductive paste includes 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group based on 100 parts by mass of the silver fine particles. The heat conductive paste has a high conductivity.