公开(公告)号：US20140078683A1

公开(公告)日：2014-03-20

申请号：US13772874

申请日：2013-02-21

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Tamir Moran ,  Gregory S. Gonzales

IPC: H03H5/02

CPC classification number: H03H5/02 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6633 ,  H01L2223/665 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01R13/7197 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.

Abstract translation: 在一个实施例中，高频模块可以包括衬底。 衬底可以包括基本上与第一表面相对的第一表面和第二表面。 高频模块可以包括耦合到第二表面的部件。 可以使用衬底向组件提供直流电。 高频模块可以包括耦合到衬底的第二表面的芯。 在一些实施例中，芯可以包括延伸穿过芯的至少一个开口。 部件可以定位在至少一个开口中。 在一些实施例中，高频模块可以包括耦合到芯的盖。 该部件可以位于基板和盖之间的至少一个开口中。

公开(公告)号：US09252734B2

公开(公告)日：2016-02-02

申请号：US13772874

申请日：2013-02-21

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Tamir Moran ,  Gregory S. Gonzales

IPC: H03H5/02 ,  H01R13/7197 ,  H01L23/66 ,  H01L25/16

CPC classification number: H03H5/02 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6633 ,  H01L2223/665 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01R13/7197 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.

Abstract translation: 在一个实施例中，高频模块可以包括衬底。 衬底可以包括基本上与第一表面相对的第一表面和第二表面。 高频模块可以包括耦合到第二表面的部件。 可以使用衬底向组件提供直流电。 高频模块可以包括耦合到衬底的第二表面的芯。 在一些实施例中，芯可以包括延伸穿过芯的至少一个开口。 部件可以定位在至少一个开口中。 在一些实施例中，高频模块可以包括耦合到芯的盖。 该部件可以位于基板和盖之间的至少一个开口中。