公开(公告)号：US20200378845A1

公开(公告)日：2020-12-03

申请号：US16634469

申请日：2018-07-27

Applicant: NEXTINPUT, INC.

Inventor： Albert BERGEMONT ,  Julius Minglin TSAI

IPC: G01L1/16 ,  G01L1/18 ,  H01L41/113

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspet, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.

公开(公告)号：US20220260435A1

公开(公告)日：2022-08-18

申请号：US17591706

申请日：2022-02-03

Applicant: NEXTINPUT, INC.

Inventor： Albert BERGEMONT ,  Julius Minglin TSAI

IPC: G01L1/16 ,  G01L1/18 ,  H01L41/113

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspect, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.

公开(公告)号：US20200278748A1

公开(公告)日：2020-09-03

申请号：US16645650

申请日：2018-09-07

Applicant: NEXTINPUT, INC.

Inventor： Julius Minglin TSAI ,  Albert BERGEMONT ,  Christopher EDWARDS ,  Ali FOUGHI

IPC: G06F3/01 ,  H01L41/09 ,  H01L41/187 ,  G01L5/1627

Abstract: Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.