公开(公告)号：US20210172813A1

公开(公告)日：2021-06-10

申请号：US16761373

申请日：2018-11-02

Applicant: NEXTINPUT, INC.

Inventor： Julius Minglin TSAI ,  Ryan DIESTELHORST ,  Dan BENJAMIN

IPC: G01L1/18 ,  G01L1/26 ,  B81B3/00 ,  B81C1/00

Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate, and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.