公开(公告)号：US20230197502A1

公开(公告)日：2023-06-22

申请号：US18065018

申请日：2022-12-13

Applicant: NGK Insulators, Ltd.

Inventor： Seiya INOUE ,  Tatsuya KUNO ,  Kanta MIYAMOTO

IPC: H01L21/687 ,  H01L21/683

CPC classification number: H01L21/68785 ,  H01L21/68757 ,  H01L21/6833

Abstract: A member for semiconductor manufacturing apparatus includes: a ceramic plate that has an upper surface including a wafer placement surface; a conductive base that is disposed on a lower surface of the ceramic plate; a first hole that extends through the ceramic plate; a second hole that extends through the conductive base; a porous plug that has an upper surface that is exposed from an upper opening of the first hole and a lower surface that is flush with or below an upper surface of the conductive base; an insulating pipe that has an upper surface that is located below the wafer placement surface and a lower surface that is located below the lower surface of the porous plug; and an integrally formed member that is obtained by integrally forming the porous plug and the insulating pipe.