BONDING STRENGTH TEST DEVICE FOR ELECTRONIC COMPONENTS AND METHOD FOR BONDING STRENGTH TEST
    1.
    发明申请
    BONDING STRENGTH TEST DEVICE FOR ELECTRONIC COMPONENTS AND METHOD FOR BONDING STRENGTH TEST 有权
    用于电子部件的结合强度测试装置和用于结合强度测试的方法

    公开(公告)号:US20160282257A1

    公开(公告)日:2016-09-29

    申请号:US15060568

    申请日:2016-03-03

    CPC classification number: G01N19/04 G11B5/455 G11B5/483 G11B5/4853

    Abstract: According to an embodiment, a bonding strength test device measures bonding strength between a flexure of a suspension of a hard disk drive and microactuators mounted on a gimbal of the flexure. The bonding strength test device includes a clamp, dummy, and device body. The clamp fixes the flexure. The dummy is adhered to the microactuators. The probe is engaged in the dummy. The device body measures a tensile load applied to the probe while the probe is pulled toward a direction to be apart from the flexure.

    Abstract translation: 根据实施例,接合强度测试装置测量硬盘驱动器的悬架的挠曲和安装在挠曲件的万向节上的微型致动器之间的结合强度。 接合强度测试装置包括夹具,假人和装置主体。 夹具固定弯曲。 假人贴在微型致动器上。 探头接合在假人中。 当探头被拉向与挠曲件分开的方向时,装置主体测量施加到探头的拉伸载荷。

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