Abstract:
According to an embodiment, a bonding strength test device measures bonding strength between a flexure of a suspension of a hard disk drive and microactuators mounted on a gimbal of the flexure. The bonding strength test device includes a clamp, dummy, and device body. The clamp fixes the flexure. The dummy is adhered to the microactuators. The probe is engaged in the dummy. The device body measures a tensile load applied to the probe while the probe is pulled toward a direction to be apart from the flexure.
Abstract:
An electrode structure of a piezoelectric element is provided. The piezoelectric element 23a (23b) constitutes a piezoelectric actuator 19 attached to an attaching part 30 of an object, to minutely move a movable part 15 of the object relative to a base part 13 of the object according to deformation occurring on the piezoelectric element in response to a power applied state of the piezoelectric element. The electrode structure in response an electrode 41a formed on one of a pair of electrode forming faces 31a and 31b of the piezoelectric element on an inner side of a peripheral zone 31a1, the peripheral zone being defined along the periphery of the electrode forming face 31a on which the electrode is formed. The electrode structure also includes a non-electrode part 51 formed in the peripheral zone. Even if the peripheral zone 31a1 of the electrode forming face 31a having a short-circuit causing possibility touches the attaching part 30, no short circuit occurs.