公开(公告)号：US20210083153A1

公开(公告)日：2021-03-18

申请号：US17001188

申请日：2020-08-24

Applicant: NICHIA CORPORATION

Inventor： Kiyoshi KAYAMA ,  Shohei MORI ,  Akinobu MAEDA

IPC: H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes: a resin package including first and second leads, and a resin part defining a recess defined by a lateral wall and an upward-facing surface, which includes an upper surface of a portion of each of the first lead, the second lead, and the resin part; and a light emitting element on the first lead. The resin part includes a holding resin portion between the first and second leads at the upward-facing surface, and a covering resin portion that covers a portion of the upper surface of the holding resin portion and a portion of an upper surface of at least one of the first and second leads. A portion of an upper surface of the holding resin portion is exposed from the covering resin portion, and is located on the same plane as the upper surfaces of the first and second leads.