公开(公告)号：US12045399B1

公开(公告)日：2024-07-23

申请号：US18105884

申请日：2023-02-06

Applicant: NOVATEK Microelectronics Corp.

Inventor： Hsin-Hong Yang ,  Yen-Cheng Cheng

IPC: G06F3/041 ,  G06F3/0354

CPC classification number: G06F3/03545 ,  G06F3/0412

Abstract: A sensing circuit, which is to be coupled to a plurality of sensor pads, includes a plurality of front-end circuits and a plurality of switches. The plurality of switches include first to sixth switches. The first switch is coupled between a first sensor pad and a first front-end circuit. The second switch is coupled between the first sensor pad and the first front-end circuit. The third switch is coupled between a second sensor pad and the first front-end circuit. The fourth switch is coupled between the second sensor pad and a second front-end circuit. The fifth switch is coupled between a third sensor pad and the second front-end circuit. The sixth switch is coupled between the third sensor pad and the second front-end circuit. Wherein, the first sensor pad, the second sensor pad, and the third sensor pad are deployed along a first direction.

公开(公告)号：US20240264681A1

公开(公告)日：2024-08-08

申请号：US18105884

申请日：2023-02-06

Applicant: NOVATEK Microelectronics Corp.

Inventor： Hsin-Hong Yang ,  Yen-Cheng Cheng

IPC: G06F3/0354 ,  G06F3/041

CPC classification number: G06F3/03545 ,  G06F3/0412

Abstract: A sensing circuit, which is to be coupled to a plurality of sensor pads, includes a plurality of front-end circuits and a plurality of switches. The plurality of switches include first to sixth switches. The first switch is coupled between a first sensor pad and a first front-end circuit. The second switch is coupled between the first sensor pad and the first front-end circuit. The third switch is coupled between a second sensor pad and the first front-end circuit. The fourth switch is coupled between the second sensor pad and a second front-end circuit. The fifth switch is coupled between a third sensor pad and the second front-end circuit. The sixth switch is coupled between the third sensor pad and the second front-end circuit. Wherein, the first sensor pad, the second sensor pad, and the third sensor pad are deployed along a first direction.

公开(公告)号：US11025253B2

公开(公告)日：2021-06-01

申请号：US16583220

申请日：2019-09-25

Applicant: NOVATEK Microelectronics Corp.

Inventor： Hsin-Hong Yang ,  Yen-Cheng Cheng

IPC: H03F1/07 ,  H03K19/0185 ,  H03F1/02 ,  H03K17/687 ,  H03F3/45

Abstract: An output stage circuit includes a first operational amplifier, a second operational amplifier, a switch circuit, a clamp circuit and at least one pull-low transistor. The first operational amplifier is operated in a first voltage domain. The second operational amplifier is operated in a second voltage domain. The switch circuit is coupled to the first operational amplifier and the second operational amplifier. The clamp circuit is coupled between the switch circuit and a plurality of output terminals of the output stage circuit. The at least one pull-low transistor is coupled to the switch circuit.

公开(公告)号：US20200343892A1

公开(公告)日：2020-10-29

申请号：US16583220

申请日：2019-09-25

Applicant: NOVATEK Microelectronics Corp.

Inventor： Hsin-Hong Yang ,  Yen-Cheng Cheng

IPC: H03K19/0185 ,  H03F3/45 ,  H03K17/687 ,  H03F1/02

Abstract: An output stage circuit includes a first operational amplifier, a second operational amplifier, a switch circuit, a clamp circuit and at least one pull-low transistor. The first operational amplifier is operated in a first voltage domain. The second operational amplifier is operated in a second voltage domain. The switch circuit is coupled to the first operational amplifier and the second operational amplifier. The clamp circuit is coupled between the switch circuit and a plurality of output terminals of the output stage circuit. The at least one pull-low transistor is coupled to the switch circuit.