公开(公告)号：US20230290715A1

公开(公告)日：2023-09-14

申请号：US17990727

申请日：2022-11-20

Applicant: NOVATEK Microelectronics Corp.

Inventor： Tsung-Ling Li ,  Yung-Cheng Lin ,  Ju-Lin Huang

IPC: H01L23/498 ,  G06F3/041 ,  G06F3/044

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  G06F3/04164 ,  G06F3/0412 ,  G06F3/0446

Abstract: A ball grid array (BGA) package for use in a touch panel controller includes a package substrate and a plurality of solder bumps. The plurality of solder bumps are disposed on the package substrate, arranged in a staggered pattern surrounding a hollow region on the package substrate, and coupled to electrodes of a touch panel via a multi-layer circuit board. The staggered pattern includes Ys1 top rows and Ys2 bottom rows, a minimum vertical distance between centers of two vertically adjacent solder bumps in the Ys1 top rows and the Ys2 bottom rows being referred to as an equivalent vertical pitch, and Ys1, Ys2 being integers exceeding 2. the hollow region has a minimum length defined by the minimum length=((Ys1−2)+(Ys2−2))*the equivalent vertical pitch.