公开(公告)号：US20230393788A1

公开(公告)日：2023-12-07

申请号：US18454693

申请日：2023-08-23

Applicant: NVIDIA Corporation

Inventor： Nilandrish Chatterjee ,  James Michael O'Connor ,  Donghyuk Lee ,  Gaurav Uttreja ,  Wishwesh Anil Gandhi

IPC: G06F3/06 ,  G06F12/06 ,  G06F12/10

CPC classification number: G06F3/0659 ,  G06F3/0604 ,  G06F12/0607 ,  G06F12/10 ,  H01L25/18 ,  G06F2212/657 ,  G06F2212/151 ,  G06F2212/154 ,  G06F3/0673

Abstract: A combined on-package and off-package memory system uses a custom base-layer within which are fabricated one or more dedicated interfaces to off-package memories. An on-package processor and on-package memories are also directly coupled to the custom base-layer. The custom base-layer includes memory management logic between the processor and memories (both off and on package) to steer requests. The memories are exposed as a combined memory space having greater bandwidth and capacity compared with either the off-package memories or the on-package memories alone. The memory management logic services requests while maintaining quality of service (QoS) to satisfy bandwidth requirements for each allocation. An allocation may include any combination of the on and/or off package memories. The memory management logic also manages data migration between the on and off package memories.