公开(公告)号：US20220028766A1

公开(公告)日：2022-01-27

申请号：US16936480

申请日：2020-07-23

Applicant: NXP B.V.

Inventor： Crispulo Estira Lictao, JR. ,  Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Stephen Ryan Hooper ,  Bernd Offermann

IPC: H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.