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1.发明申请公开(公告)号：US20220347799A1
公开(公告)日：2022-11-03
申请号：US17812352
申请日：2022-07-13
Applicant: OSAKA UNIVERSITY
Inventor： Katsuaki SUGANUMA , Chuantong CHEN , Toshiyuki ISHINA , Seungjun NOH , Chanyang CHOE
Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).
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2.发明申请公开(公告)号：US20200039007A1
公开(公告)日：2020-02-06
申请号：US16487924
申请日：2018-02-23
Applicant: OSAKA UNIVERSITY
Inventor： Katsuaki SUGANUMA , Chuantong CHEN , Toshiyuki ISHINA , Seungjun NOH , Chanyang CHOE
Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).
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