公开(公告)号：US20220056295A1

公开(公告)日：2022-02-24

申请号：US17274995

申请日：2019-09-13

Applicant: OSAKA UNIVERSITY ,  SHOWA DENLO K.K.

Inventor： Teppei ARAKI ,  Tsuyoshi SEKITANI ,  Jun KUWAHARA ,  Nobuaki ISHII ,  Hideki OHATA

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/14 ,  C09D11/106 ,  H05K1/09

Abstract: [Problem] To provide an electroconductive ink suitable for an inexpensive carbon wiring substrate having a wide strain sensing range, and a carbon wiring substrate in which the electroconductive ink is used.
[Solution] An electroconductive ink characterized by including a carbonaceous electroconductive material (A), a binder resin (B) including a cellulose compound (B1) and a poly N-vinyl compound (B2), and a solvent (C), the electroconductive ink including 0.5-23 parts by mass of the binder resin (B) with respect to 100 parts by mass of the carbonaceous electroconductive material (A), the mass blending ratio of the cellulose compound (B1) and the poly N-vinyl compound (B2) being 80:20 to 40:60, and the solvent (C) including water (C1). A carbon wiring substrate having a wiring pattern formed using the electroconductive ink.