-
公开(公告)号：US11195974B2
公开(公告)日：2021-12-07
申请号：US16753808
申请日：2018-09-25
Applicant: OSRAM OLED GmbH
Inventor： Roland Heinrich Enzmann , Lorenzo Zini , Vanessa Eichinger , Jochen Brendt
Abstract: A semiconductor chip may include a substrate and a semiconductor body positioned thereon. The semiconductor body has a first semiconductor layer and a second semiconductor layer with an active zone sandwiched therebetween. At least one current spreading layer is designed to electrically contact the first semiconductor layer positioned between the substrate and the semiconductor body. A metal layer is designed to electrically contact the second semiconductor layer positioned between the substrate and the current spreading layer where the metal layer fully covers the current spreading layer. An insulating layer may be positioned between the current spreading layer and the metal layer in the vertical direction to where the metal layer is electrically insulated from the current spreading layer.
-
公开(公告)号：US20200287089A1
公开(公告)日：2020-09-10
申请号：US16753808
申请日：2018-09-25
Applicant: OSRAM OLED GmbH
Inventor： Roland Heinrich Enzmann , Lorenzo Zini , Vanessa Eichinger , Jochen Brendt
Abstract: A semiconductor chip may include a substrate and a semiconductor body positioned thereon. The semiconductor body has a first semiconductor layer and a second semiconductor layer with an active zone sandwiched therebetween. At least one current spreading layer is designed to electrically contact the first semiconductor layer positioned between the substrate and the semiconductor body. A metal layer is designed to electrically contact the second semiconductor layer positioned between the substrate and the current spreading layer where the metal layer fully covers the current spreading layer. An insulating layer may be positioned between the current spreading layer and the metal layer in the vertical direction to where the metal layer is electrically insulated from the current spreading layer.
-
Search Results
2
records
(took 0.02 seconds)
