公开(公告)号：US20220293815A1

公开(公告)日：2022-09-15

申请号：US17632523

申请日：2020-07-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Brendan HOLLAND

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/20

Abstract: A method for producing a radiation emitting semiconductor chip may include providing a semiconductor layer sequence having an active region configured to generate electromagnetic radiation, applying a reflective layer sequence over the semiconductor layer sequence, generating a first recess through an opening of a mask where the first recess completely penetrates the reflective layer sequence and the active region, and applying a dielectric mirror layer in the first recess through the same opening of the same mask. Furthermore, a radiation emitting semiconductor chip is disclosed.

公开(公告)号：US20220319400A1

公开(公告)日：2022-10-06

申请号：US17610631

申请日：2020-04-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Brendan HOLLAND ,  Gunnar PETERSEN ,  Daniel RICHTER

IPC: G09G3/32

Abstract: A display apparatus includes a multiplicity of picture elements for emitting visible light in different colors in an adjustable manner by means of a plurality of semiconductor layer sequences. Each of the picture elements has a plurality of types of pixels and each type of pixels is configured for emitting light of a specific color. The pixels are each subdivided into a plurality of sub-pixel. All the sub-pixels are configured for emitting light of the same color out of the display apparatus without further color change. At least two sub-pixels within each pixel have emission areas of different sizes. An electrical control unit is assigned to each pixel. The control units are each configured to automatically control the sub-pixels of a relevant pixel depending on an energization intensity in such a way that a light-emitting area of the relevant pixel increases in stepped fashion with the energization intensity.

公开(公告)号：US20220320387A1

公开(公告)日：2022-10-06

申请号：US17624816

申请日：2020-06-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel RICHTER ,  Brendan HOLLAND

IPC: H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  G02B5/22 ,  H01S5/0232 ,  C09K11/06 ,  C09K11/02

Abstract: An optoelectronic component is specified comprising: at least one radiation-emitting semiconductor chip (1) which during operation emits electromagnetic radiation of a first wavelength range, and an absorber, wherein the absorber is predominantly transmissive to the emitted electromagnetic radiation of the first wavelength range, and the absorber absorbs at least 70% of the total radiation intensity of the electromagnetic spectrum of the visible light of the ambient light.