公开(公告)号：US08575578B1

公开(公告)日：2013-11-05

申请号：US13788757

申请日：2013-03-07

Applicant: Oriental System Technology Inc.

Inventor： Jin-Shown Shie ,  Chen-Tang Huang ,  Chung-Nan Chen

IPC: G01N21/35 ,  G01N21/00

CPC classification number: G01N21/3504

Abstract: A chip-scale infrared emitter package comprises an emitter chip and an enclosure. The emitter chip includes: a base having a central cavity; a membrane having a peripheral end, the peripheral end being isolated from a periphery of the central cavity by a loop-shaped gap; an electric resistor formed on the membrane; at least one slim supporting beam extending from the peripheral end of the membrane through the loop-shaped gap to the base; and a reflective material coated on the membrane. The enclosure has a can housing and a transparent window plate. The window plate cooperates with the can housing to define an enclosed vacuum chamber. The emitter chip is mounted in the enclosed vacuum chamber. The enclosed vacuum chamber has a pressure less than 0.01 torr.

Abstract translation: 芯片级红外发射器封装包括发射极芯片和外壳。 发射极芯片包括：具有中心腔的基座; 具有外周端的膜，所述外周端通过环形间隙与所述中心腔的周边隔离; 形成在膜上的电阻器; 至少一个细长的支撑梁，从膜的周边端部延伸穿过环形间隙到基部; 和涂覆在膜上的反射材料。 外壳具有罐壳和透明窗板。 窗板与罐壳体配合以限定封闭的真空室。 发射极芯片安装在封闭的真空室中。 封闭的真空室的压力小于0.01乇。