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公开(公告)号:US20240339471A1
公开(公告)日:2024-10-10
申请号:US18744109
申请日:2024-06-14
Inventor: Daisuke WAKABAYASHI , Yuuko TOMEKAWA
IPC: H01L27/146 , H04N25/77
CPC classification number: H01L27/14623 , H01L27/14612 , H01L27/14636 , H04N25/77
Abstract: An imaging device includes a pixel section and a peripheral circuitry section provided around the pixel section. The pixel section includes: a photoelectric conversion film; a top electrode located above the photoelectric conversion film; bottom electrodes that face the top electrode, with the photoelectric conversion film being disposed between the top electrode and the bottom electrodes; and a first light-shielding film that overlaps part of the photoelectric conversion film in a plan view and that is electrically connected to the top electrode. The first light-shielding film has electrical conductivity. The peripheral circuitry section includes peripheral circuitry and a second light-shielding film that overlaps at least part of the peripheral circuitry in the plan view. The first light-shielding film and the second light-shielding film are separated from each other.