公开(公告)号：US20190104640A1

公开(公告)日：2019-04-04

申请号：US15722035

申请日：2017-10-02

Applicant: Plume Design, Inc.

Inventor： Richard Tzewei CHANG ,  Yoseph MALKIN ,  Patrick HANLEY ,  Jeffrey ChiFai LIEW ,  Liem Hieu Dinh VO ,  Duc Minh NGUYEN ,  Nora YAN ,  Hiroshi MENDOZA ,  William MCFARLAND

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/11

Abstract: An electronic device includes a first circuit board and a second circuit board each stacked relative to one another; and a mid-spreader disposed between the first circuit board and the second circuit board, wherein the mid-spreader includes a heat conductive material in thermal contact with one or more components on each of the first circuit board and the second circuit board to act as a heat sink, and wherein the mid-spreader is thermally connected to one or more heat sinks, the mid-spreader is one of disposed to or integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board and the second circuit board to conduct and transfer heat therefrom.