公开(公告)号：US20210257726A1

公开(公告)日：2021-08-19

申请号：US17164494

申请日：2021-02-01

Applicant: QUALCOMM Incorporated

Inventor： Sean Joel LYN ,  Cheng-Han WANG ,  Hye Jin SONG ,  Hai HUANG ,  Sang-Oh LEE

IPC: H01Q1/50 ,  H01P5/10

Abstract: An area-efficient balun and a method for signal processing using such a balun. One example balun generally includes a winding and a clamping circuit. The winding is formed by a coiled trace including a first portion having a first trace width and a second portion having a second trace width, the second trace width being narrower than the first trace width. The clamping circuit has a first terminal and a second terminal, the first terminal of the clamping circuit being coupled to the first portion of the coiled trace.