公开(公告)号：US11147196B1

公开(公告)日：2021-10-12

申请号：US16839625

申请日：2020-04-03

Applicant: QUANTA COMPUTER INC.

Inventor： Ching-Jen Chen ,  Cheng-Hsien Lee

IPC: H05K9/00 ,  H01Q17/00 ,  H05K7/14 ,  H05K7/20

Abstract: An air duct formed from an electromagnetic wave absorber in the form of a sheet is disclosed. The sheet can be bent into a duct or scored, and folded at the score lines to bring the ends of the sheet into proximity. The ends can then be joined by adhesive, welding, or mechanical fasters. The air ducts disclosed herein provide dual functions of providing ventilation for electronic components in an electronic module, while at the same time, reducing electromagnetic interference (EMI). One or more air ducts, of the same or different dimensions, shapes, volumes can be combined with electronic modules, such as a server, to provide both ventilation and EMI suppression to various components within the electronic module.

公开(公告)号：US10986743B2

公开(公告)日：2021-04-20

申请号：US16704635

申请日：2019-12-05

Applicant: Quanta Computer Inc.

Inventor： Cheng-Hsien Lee

IPC: H05K5/02 ,  H05K1/02 ,  H05K1/14 ,  H05K5/00

Abstract: The present disclosure describes an expansion card interface for a printed circuit board. The expansion card interface includes a substrate having an edge. The expansion card interface further includes a plurality of signal pins configured to communicate one or more signals to and from the printed circuit board. The expansion card interface further includes a plurality of ground pins adjacent to the plurality of signal pins configured to provide a ground. At least one signal pin of the plurality of signal pins extends closer to the edge of the substrate than at least one ground pin of the plurality of ground pins.

公开(公告)号：US10820410B2

公开(公告)日：2020-10-27

申请号：US16291941

申请日：2019-03-04

Applicant: QUANTA COMPUTER INC.

Inventor： Cheng-Hsien Lee

IPC: H05K1/02

Abstract: A high speed circuit and a method for fabricating the same is disclosed. The high speed circuit has a printed circuit board. A pair of first and second differential traces are formed on a first surface of the printed circuit board. The differential traces carry an electrical signal. A partial loop extends through the printed circuit board. The partial loop includes first and second end slots under the first and second differential traces. The partial loop includes a pair of side slots substantially parallel to the differential traces. An anchor member connects the printed circuit board to an island formed by the first and second end slots and side slots. The anchor member forms a gap in one of the end slots or side slots. The length of the side slots and the length of the gap is selected to reduce a target common mode frequency from the electrical signal.

公开(公告)号：US20200275566A1

公开(公告)日：2020-08-27

申请号：US16704635

申请日：2019-12-05

Applicant: Quanta Computer Inc.

Inventor： Cheng-Hsien Lee

IPC: H05K5/02 ,  H05K5/00 ,  H05K1/14 ,  H05K1/02

Abstract: The present disclosure describes an expansion card interface for a printed circuit board. The expansion card interface includes a substrate having an edge. The expansion card interface further includes a plurality of signal pins configured to communicate one or more signals to and from the printed circuit board. The expansion card interface further includes a plurality of ground pins adjacent to the plurality of signal pins configured to provide a ground. At least one signal pin of the plurality of signal pins extends closer to the edge of the substrate than at least one ground pin of the plurality of ground pins.

公开(公告)号：US10667384B2

公开(公告)日：2020-05-26

申请号：US16037625

申请日：2018-07-17

Applicant: QUANTA COMPUTER INC.

Inventor： Cheng-Hsien Lee

IPC: H05K1/02 ,  H05K1/18

Abstract: A differential trace structure reducing the magnitude of low frequency attenuation is disclosed. The trace structure is formed on a printed circuit board. A pair of differential traces connects a signal receiver and a signal transmitter. A passive equalizer has a first shunt coupled to one of the pair of differential traces; and a second shunt coupled to the other one of the pair of differential traces. The passive equalizer has an inductor and a resistor coupled in series to the shunts. For low frequency signals, the passive equalizer behaves as a shunt resistance to the pair of differential traces.

公开(公告)号：US10784607B2

公开(公告)日：2020-09-22

申请号：US16418271

申请日：2019-05-21

Applicant: QUANTA COMPUTER INC.

Inventor： Cheng-Hsien Lee

IPC: H05K1/00 ,  H01R12/73 ,  H05K1/02

Abstract: A connector assembly is disclosed to reduce discontinuity impedance between golden finger connectors and components on a circuit board. The assembly includes a circuit board including a connector edge. A plurality of connectors is formed on the connector edge on a first surface of the circuit board. A ground plane is formed on part of the circuit board on a second opposite surface of the first surface. The ground plane leaves the second opposite surface under the connector edge exposed. A ground loop is formed on the second opposite surface under at least two of the plurality of connectors.

公开(公告)号：US10999929B2

公开(公告)日：2021-05-04

申请号：US16714181

申请日：2019-12-13

Applicant: Quanta Computer Inc.

Inventor： Che-Wei Chang ,  Cheng-Hsien Lee

IPC: H05K1/11 ,  H05K1/14 ,  H05K5/02 ,  H05K5/04 ,  G06K19/067 ,  G06K19/077 ,  H01R12/00 ,  H01R13/64 ,  H01R13/6461 ,  H05K3/04 ,  H05K3/06 ,  H05K3/40

Abstract: The present disclosure describes expansion card interfaces for a printed circuit board and methods of making the same. The methods include forming electrical pads of the expansion card interface on a substrate, and dividing at least one electrical pad into a first portion and a second portion. The resulting expansion card interfaces have the first portion conductively coupled to a circuit on the printed circuit board, and the second portion conductively isolated from the first portion.

公开(公告)号：US20200383205A1

公开(公告)日：2020-12-03

申请号：US16714181

申请日：2019-12-13

Applicant: Quanta Computer Inc.

Inventor： Che-Wei Chang ,  Cheng-Hsien Lee

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/04 ,  H05K3/06

Abstract: The present disclosure describes expansion card interfaces for a printed circuit board and methods of making the same. The methods include forming electrical pads of the expansion card interface on a substrate, and dividing at least one electrical pad into a first portion and a second portion. The resulting expansion card interfaces have the first portion conductively coupled to a circuit on the printed circuit board, and the second portion conductively isolated from the first portion.