公开(公告)号：US20230262926A1

公开(公告)日：2023-08-17

申请号：US17660631

申请日：2022-04-25

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Cheng-Yu WEN ,  Hung-Yuan CHEN

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20254 ,  H05K7/20772

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.