公开(公告)号：US20160143188A1

公开(公告)日：2016-05-19

申请号：US14659528

申请日：2015-03-16

Applicant: Quanta Computer Inc.

Inventor： Ping-Sheng KAO ,  Jer-Kuang LU ,  Wei-Cheng LIAO ,  Jih-Sheng YEH

IPC: H05K7/20

CPC classification number: G06F1/203 ,  F04D29/4226 ,  F04D29/441 ,  F04D29/582 ,  H01L23/467 ,  H05K7/20154 ,  H05K7/20172

Abstract: A heat dissipating module includes a bottom cover, a top cover, a fan body, and a heat dissipating structure. The top cover is disposed opposite the bottom cover, in which an air outlet is formed by the top cover and the bottom cover. The fan body is disposed between the top cover and the bottom cover, and the fan body provides an airflow toward the air outlet. The heat dissipating structure is disposed in front of the air outlet, in which the heat dissipating structure and the bottom cover are formed with a one-piece metal sheet. The heat dissipating structure is bent from the bottom cover toward the air outlet. The heat dissipating structure includes openings, such that the airflow passes through the openings from the air outlet and performs heat exchange with the heat dissipating structure.

Abstract translation: 散热模块包括底盖，顶盖，风扇主体和散热结构。 顶盖与底盖相对设置，其中空气出口由顶盖和底盖形成。 风扇主体设置在顶盖和底盖之间，风扇主体向空气出口提供气流。 散热结构设置在出风口的前方，其散热结构和底盖由一体式金属板形成。 散热结构从底盖向空气出口弯曲。 散热结构包括开口，使得空气从空气出口流过开口并与散热结构进行热交换。