公开(公告)号：US20190037738A1

公开(公告)日：2019-01-31

申请号：US16132536

申请日：2018-09-17

申请人： Manufacturing Resources International, Inc.

发明人： William Dunn ,  Don Le ,  Ware Bedell

IPC分类号： H05K7/20 ,  G02F1/1335

CPC分类号： H05K7/20972 ,  F28F3/00 ,  G02F1/133382 ,  G02F1/133385 ,  G02F1/133615 ,  G02F2001/133342 ,  G02F2201/36 ,  H05K7/20154 ,  H05K7/20963

摘要： Disclosed herein is an electronic display assembly having a thermally conductive housing and an image assembly. The image assembly is positioned within the thermally conductive housing and behind a transparent plate assembly. An inlet opening and outlet opening are formed by gaps located between opposing edges of the image assembly and the housing. A space between the image assembly and the plate assembly forms a channel. Thermally conductive plates extend from near the image assembly within each of the inlet opening and outlet opening to contact the housing. Heat from the image assembly is conductively transferred to the housing by the thermally conductive plates. A fan may be positioned to circulate cooling air through the channel via the inlet and outlet openings and apertures in the thermally conductive plates.

公开(公告)号：US20190008077A1

公开(公告)日：2019-01-03

申请号：US16013184

申请日：2018-06-20

申请人： FUJITSU LIMITED

发明人： Minoru Ishinabe

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H05K7/20154 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20736 ,  H05K7/20836

摘要： A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.

公开(公告)号：US20190006802A1

公开(公告)日：2019-01-03

申请号：US16019850

申请日：2018-06-27

申请人： LOTES CO., LTD.

发明人： Ted Ju ,  Chin Chi Lin

IPC分类号： H01R24/78 ,  H01R43/02 ,  H01R13/66 ,  H01R13/516 ,  H05K7/20

CPC分类号： H01R24/78 ,  G06F1/20 ,  H01R13/46 ,  H01R13/516 ,  H01R13/6658 ,  H01R24/60 ,  H01R43/0256 ,  H05K7/20154 ,  H05K7/2039 ,  H05K7/20918

摘要： An assembly includes: a socket connector, having an insulating seat, multiple mating terminals and a metal shell provided outside the insulating seat; at least one first thermal conduction member located outside the metal shell; and a plug connector, including: a circuit board; at least one chip provided on the circuit board; a mating joint electrically connected to one end of the circuit board and having an insulating body, multiple conductive terminals, and a shielding shell provided outside the insulating body; and at least one second thermal conduction member having a conducting portion thermally conductive with the chip and a protruding portion located outside the shielding shell. When the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.

公开(公告)号：US20180310396A1

公开(公告)日：2018-10-25

申请号：US15962207

申请日：2018-04-25

申请人： Ryo Kobayashi ,  Tomoyoshi Kobayashi

发明人： Ryo Kobayashi ,  Tomoyoshi Kobayashi

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC分类号： H05K1/0204 ,  H05K1/181 ,  H05K1/184 ,  H05K7/20154 ,  H05K7/20409 ,  H05K7/20445 ,  H05K7/20918 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10628

摘要： A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

公开(公告)号：US10085361B2

公开(公告)日：2018-09-25

申请号：US15646561

申请日：2017-07-11

申请人： LOTES CO., LTD

发明人： Chin Chi Lin

IPC分类号： H05K7/20 ,  G06F1/20 ,  H05K1/02 ,  H01R12/72 ,  H01R12/73 ,  H05K5/02 ,  H05K7/14 ,  H05K1/14

CPC分类号： H05K7/20154 ,  G06F1/203 ,  H01R12/721 ,  H01R12/722 ,  H01R12/73 ,  H05K1/0203 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K5/0247 ,  H05K5/0286 ,  H05K7/1427 ,  H05K7/20145 ,  H05K7/20163 ,  H05K7/20436 ,  H05K2201/10325 ,  H05K2201/10356

摘要： An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

公开(公告)号：US10061364B2

公开(公告)日：2018-08-28

申请号：US15505739

申请日：2014-10-28

申请人： Hitachi, Ltd.

发明人： Toru Kobayashi ,  Tadaharu Maeda ,  Syun Nakayama

IPC分类号： H05K7/20 ,  G06F1/20 ,  G11B33/14 ,  G06F1/26 ,  H01L23/473

CPC分类号： G06F1/20 ,  G06F1/263 ,  G11B33/128 ,  G11B33/14 ,  G11B33/142 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20727

摘要： The present invention aims at improving a cooling efficiency and a maintenance workability related to heat generating components in a storage subsystem. Therefore, the present invention provides multiple cooling fans configured to cool multiple components for operating the storage subsystem, a first wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a first component, a second wind direction panel defining a passage configured to blow a cooling air generated by the cooling fans to a second component having a smaller heating value than the first heat generating component and having a low temperature, and a chassis configured to store the multiple components, the cooling fans and the first and second wind direction panels, wherein the second wind direction panel is configured to be integrated with a side wall of the chassis and detachable from the chassis.

公开(公告)号：US10058010B2

公开(公告)日：2018-08-21

申请号：US15395103

申请日：2016-12-30

申请人： UACJ Corporation

发明人： Yuki Totani ,  Tetsuro Hata ,  Yasuhiro Yagita ,  Kazuyoshi Shoutsubo

IPC分类号： H05K7/20 ,  H01L23/473 ,  F28F3/06 ,  F28F3/12 ,  H01L23/467

CPC分类号： H05K7/20509 ,  F28F3/06 ,  F28F3/12 ,  F28F2275/14 ,  H01L23/467 ,  H01L23/473 ,  H05K7/20154

摘要： A heat-exchanger heat sink (1; 102; 103; 104) includes a plurality of fin plates (2; 202; 203; 203a, 203b; 205), which are lined up spaced apart from one another in a plate-thickness direction; and at least one linking part (3; 3a, 3b; 304), which is disposed such that it intersects and hold the plurality of fin plates (2). The at least one linking part has a base (31), which may be rod or bar shaped, and a plurality of positioning protrusions (32), which protrude from a side surface of the base. Each of the fin plates has at least one latching groove (21, 26), into which the base is inserted such that each fin plate is located between adjacent positioning protrusions of the at least one linking part.

公开(公告)号：US10037062B1

公开(公告)日：2018-07-31

申请号：US15462562

申请日：2017-03-17

申请人： Microsoft Technology Licensing, LLC

发明人： Siddharth Bhopte ,  Daniel J. Dummer ,  Virendra Jadhav ,  Andrew Douglas Delano

IPC分类号： H05K7/20 ,  G06F1/20 ,  G06F1/18

CPC分类号： G06F1/206 ,  G06F1/183 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20172 ,  H05K7/20209

摘要： A thermal venting device is provided that includes a plenum including an inlet port and a plurality of outlet ports, the plenum being substantially fluidically sealed except for the inlet port and the plurality of outlet ports, the inlet port including an inlet fan configured to pressurize the plenum, each of the plurality of outlet ports being configured to direct airflow from the pressurized plenum toward different electronic components of a plurality of electronic components, and each of the plurality of outlet ports including respective resistive elements having varied airflow resistances configured to bias airflow through the plurality of outlet ports.

公开(公告)号：US20180184546A1

公开(公告)日：2018-06-28

申请号：US15808825

申请日：2017-11-09

申请人： Chien-Ming Su ,  Chang-Yuan Wu ,  I-Feng Hsu ,  Jen-Chang Chen

发明人： Chien-Ming Su ,  Chang-Yuan Wu ,  I-Feng Hsu ,  Jen-Chang Chen

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20154 ,  G06F1/203 ,  H05K7/20145 ,  H05K7/2029

摘要： An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.

公开(公告)号：US09992890B1

公开(公告)日：2018-06-05

申请号：US15372275

申请日：2016-12-07

申请人： Raytheon Company

发明人： Florian P. Lukowski, Jr. ,  Paul M. Shaheen ,  Charles Chu

IPC分类号： H05K7/20 ,  F16F7/104 ,  H05K5/02 ,  F16F9/32 ,  F16F7/10 ,  F16F9/10 ,  F16F15/023

CPC分类号： H05K5/0256 ,  F16F7/1017 ,  F16F7/104 ,  F16F9/103 ,  F16F9/3207 ,  F16F15/023 ,  F16F2222/08 ,  F16F2222/12 ,  F16F2230/06 ,  F16F2234/08 ,  F16F2238/04 ,  H01L23/473 ,  H05K7/20154 ,  H05K7/20218 ,  H05K7/20263 ,  H05K7/2039

摘要： A system or structure subject to external mechanical dynamic loading excitations propagated within the system or structure comprising a fluid filled structure and a fluid volume operable to facilitate fluid flow about at least part of the structure. Excitations within the structure can be propagated throughout. The system can further comprise a tuned mass damper (TMD) located within the fluid volume. The TMD can leverage the viscous properties of the fluid to attenuate the excitations within the structure. The TMD can comprise a mass and a spring operably connected to the mass. The TMD can further comprise a fluid resistance facilitating fluid flow about the mass and the spring for damping and a secondary tuning feature operably connected to at least one of the mass and the spring and the supporting fluid-filled structure.