公开(公告)号：US12124302B2

公开(公告)日：2024-10-22

申请号：US17903770

申请日：2022-09-06

Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.

Inventor： Jeffrey S Holland ,  Rachel Pollock ,  Bejoy J Kochuparambil

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20409 ,  H05K7/20509 ,  H05K7/20736 ,  G06F2200/201

Abstract: A combination heat sink/air director apparatus includes conduction plates extending into gaps between dual in-line memory module (“DIMM”) installed in computing device. A plurality of thermal interface material (“TIM”) pads are coupled to each side of each of the plurality of conduction plates. A heat sink thermally is coupled to the conduction plates and mounted above the conduction plates. Air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow. Each conduction plate and the TIM pads coupled to each side of the conduction plate are sized to contact and thermally couple to the DIMMs of the plurality of DIMMs on either side of the conduction plate and associated TIM pads.

公开(公告)号：US12122251B2

公开(公告)日：2024-10-22

申请号：US18057890

申请日：2022-11-22

Applicant: Delphi Technologies IP Limited

Inventor： Jack Lavern Glenn ,  Mark Russell Keyse ,  Peter Allan Laubenstein ,  Srikanth Vijaykumar

IPC: B60L50/60 ,  B60L3/00 ,  B60L15/00 ,  B60L15/08 ,  B60L50/40 ,  B60L50/51 ,  B60L50/64 ,  B60L53/20 ,  B60L53/22 ,  B60L53/62 ,  B60R16/02 ,  G01R15/20 ,  G06F1/08 ,  G06F13/40 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/467 ,  H01L23/473 ,  H01L23/495 ,  H01L23/538 ,  H01L25/00 ,  H01L25/07 ,  H01L29/66 ,  H02J7/00 ,  H02M1/00 ,  H02M1/08 ,  H02M1/084 ,  H02M1/088 ,  H02M1/12 ,  H02M1/32 ,  H02M1/42 ,  H02M1/44 ,  H02M3/335 ,  H02M7/00 ,  H02M7/537 ,  H02M7/5387 ,  H02M7/5395 ,  H02P27/06 ,  H02P27/08 ,  H02P29/024 ,  H02P29/68 ,  H05K1/14 ,  H05K1/18 ,  H05K5/02 ,  H05K7/20 ,  B60L15/20 ,  H03K19/20

CPC classification number: B60L50/60 ,  B60L3/003 ,  B60L15/007 ,  B60L15/08 ,  B60L50/40 ,  B60L50/51 ,  B60L50/64 ,  B60L53/20 ,  B60L53/22 ,  B60L53/62 ,  B60R16/02 ,  G01R15/20 ,  G06F1/08 ,  G06F13/4004 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/5383 ,  H01L24/32 ,  H01L24/33 ,  H01L25/072 ,  H01L25/50 ,  H01L29/66553 ,  H02J7/0063 ,  H02M1/0009 ,  H02M1/0054 ,  H02M1/08 ,  H02M1/084 ,  H02M1/088 ,  H02M1/123 ,  H02M1/32 ,  H02M1/322 ,  H02M1/327 ,  H02M1/4258 ,  H02M1/44 ,  H02M3/33523 ,  H02M7/003 ,  H02M7/537 ,  H02M7/5387 ,  H02M7/53871 ,  H02M7/53875 ,  H02M7/5395 ,  H02P27/06 ,  H02P27/08 ,  H02P27/085 ,  H02P29/024 ,  H02P29/027 ,  H02P29/68 ,  H05K1/145 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0247 ,  H05K7/20154 ,  H05K7/2049 ,  H05K7/20854 ,  H05K7/209 ,  H05K7/20927 ,  B60L15/20 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2210/42 ,  B60L2210/44 ,  B60L2240/36 ,  G06F2213/40 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H02J2207/20 ,  H02P2207/05 ,  H03K19/20 ,  H05K2201/042 ,  H05K2201/10166

Abstract: A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a galvanic interface configured to separate a high voltage area from a low voltage area; a low voltage message manager in the low voltage area; a high voltage message manager in the high voltage area, and configured to communicate with the low voltage message manager; and a point-of-use message manager in the high voltage area, and configured to communicate with the high voltage message manager.

公开(公告)号：US20240345635A1

公开(公告)日：2024-10-17

申请号：US18757145

申请日：2024-06-27

Applicant: APPLE INC.

Inventor： Brett W. Degner ,  Caitlin Elizabeth Kalinowski ,  Richard D. Kosoglow ,  Joshua D. Banko ,  David H. Narajowski ,  Jonathan L. Berk ,  Michael E. Leclerc ,  Michael D. McBroom ,  Asif Iqbal ,  Paul S. Michelsen ,  Mark K. Sin ,  Paul A. Baker ,  Harold L. Sontag ,  Wai Ching Yuen ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Alexander C. Calkins ,  Daniel L. McBroom

IPC: G06F1/18 ,  G06F1/20 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/40 ,  H05K1/02 ,  H05K5/03 ,  H05K7/20

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (V/O) interface board, an interconnect board, and a power supply unit (PSU).

公开(公告)号：US20240276665A1

公开(公告)日：2024-08-15

申请号：US18268593

申请日：2021-12-13

Applicant: NIDEC INSTRUMENTS CORPORATION

Inventor： Hajime TAKAGI

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/1402 ,  H05K7/20145 ,  H05K7/20154

Abstract: A control circuit board includes a signal output connector having an output terminal for outputting a control signal, a DC voltage input connector to which power generated by a power supply circuit board is input, and a power output connector including an output terminal for outputting the power. A drive circuit board includes a signal input connector having an input terminal for inputting a control signal, and a power input connector having an input terminal for inputting the power. The power supply circuit board includes a power output part for outputting power. The drive circuit board is held on the control circuit board in such a posture as to rise from a board surface of the control circuit board by connection between the signal input connector and the signal output connector, and connection between the power input connector and the power output connector.

公开(公告)号：US20240256013A1

公开(公告)日：2024-08-01

申请号：US18424356

申请日：2024-01-26

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Prabhu Sathyamurthy ,  Nilesh Sudhir Hasabnis ,  Shekhar Halakatti

IPC: G06F1/20 ,  G06F1/16 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1658 ,  G06F1/206 ,  H05K7/20154 ,  H05K7/20272 ,  G06F2200/201

Abstract: A mobile phone is described. The mobile phone includes a cover, a circuit board to which a heat-generating structure is coupled, and a cooling system including active cooling cell(s) and contained by the cover. The cover defines an interior of the mobile phone. The circuit board is within the interior. The heat-generating structure is thermally coupled with the cooling system. The active cooling cell(s) utilize vibrational motion to drive a fluid for transferring heat from the heat-generating structure. At least one of the mobile phone includes an interposer, the cover includes a raised portion, or the mobile phone includes a cavity therein. The interposer is coupled to the circuit board and includes a gap such that a first portion of the cooling system thermally coupled with the heat-generating structure resides within the gap. The raised portion of the cover is such that a second portion of the cooling system resides in the raised portion. The cavity includes the cooling system, separates the cooling system from the interior, and is such that the interior is water resistant.

公开(公告)号：US20240244739A1

公开(公告)日：2024-07-18

申请号：US18406677

申请日：2024-01-08

Applicant: MILWAUKEE ELECTRIC TOOL CORPORATION

Inventor： Joshua D. Widder ,  Kyle J. Krause

IPC: H05K1/02 ,  F04D25/06 ,  H02K7/14 ,  H05K3/28 ,  H05K7/20

CPC classification number: H05K1/0204 ,  F04D25/06 ,  H02K7/14 ,  H05K3/284 ,  H05K7/20154 ,  H05K2201/066

Abstract: A printed circuit board assembly for use in a power tool includes a potting boat, a printed circuit board, a thermally conductive gap pad, potting material, and a secondary heat sink. The potting boat includes primary heat sink fins. The electronic components are mounted on a first surface of the printed circuit board. The gap pad contacts the electronic component and the stand-off. The potting material at least partially encapsulates the printed circuit board within the potting boat. The secondary heat sink contacts a second surface of the printed circuit board opposite the first surface. The secondary heat sink includes secondary heat sink fins. Heat generated by the electronic components is transferred via conduction to both the primary heat sink fins and the secondary heat sink fins. The heat is dissipated to the surroundings of the printed circuit board assembly.

公开(公告)号：US20240215196A1

公开(公告)日：2024-06-27

申请号：US18596926

申请日：2024-03-06

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0203 ,  H05K2201/066

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20240206109A1

公开(公告)日：2024-06-20

申请号：US18334403

申请日：2023-06-14

Applicant: TOSHIBA TEC KABUSHIKI KAISHA

Inventor： Tsuyoshi Sanada

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20154 ,  G06F1/206 ,  H05K7/2039

Abstract: A cooling device for an electronic apparatus includes a heat sink configured to dissipate heat generated from the electronic apparatus by allowing air introduced from the outside to pass between a plurality of fins, a first air blower that has a first discharge surface for discharging air introduced from the outside toward the heat sink, a second air blower that has the same size as the first air blower and has a second discharge surface for discharging air. A sum of a diameter of the first discharge surface and a diameter of the second discharge surface is larger than a width of the heat sink, and the first discharge surface and the second discharge surface are disposed upstream of the fins in a manner of being symmetrical relative to a plane with an included angle of 90 degrees or more between the first discharge surface and the second discharge surface.

公开(公告)号：US11997830B2

公开(公告)日：2024-05-28

申请号：US17083597

申请日：2020-10-29

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20745 ,  H05K7/20154 ,  H05K7/202 ,  H05K7/20209 ,  H05K7/20836

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) is provided to determine a change in a power state or a coolant state of at least one server and to enable a coolant response from an overhead cooling unit (OCU) to dissipate heat from secondary coolant of a secondary cooling loop.

公开(公告)号：US20240155804A1

公开(公告)日：2024-05-09

申请号：US18361946

申请日：2023-07-31

Applicant: TOSHIBA TEC KABUSHIKI KAISHA

Inventor： Tsuyoshi Sanada

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20145 ,  G06F1/203 ,  H05K7/20154 ,  H05K7/2039

Abstract: A cooling apparatus for an electronic device includes a branch wall provided in a duct and divides an exhaust direction from an exhaust port into two. The branch wall is inclined such that two plate-shaped portions continuous with each other on one side are separated from each other. A plurality of the branch ribs is provided side by side in a thickness direction and protrudes from the branch wall. The branch ribs have a mountain shaped plate shape with a most protruding top portion having an acute angle. The branch ribs are inserted into gaps between the fins. The main rib, among the plurality of branch ribs, is adjacent to the fin erected on a back surface of the base portion at a position in contact with the electronic component, and has a volume larger than that of the other branch ribs.