公开(公告)号：US20130222327A1

公开(公告)日：2013-08-29

申请号：US13406845

申请日：2012-02-28

Applicant: RONALD Steven COK ,  Terrence Robert O'Toole

Inventor： RONALD Steven COK ,  Terrence Robert O'Toole

IPC: G06F3/045

CPC classification number: G06F3/044 ,  G02F1/13439 ,  G06F3/045 ,  G06F2203/04112

Abstract: An electronic device includes a support having greater than 80% transmittance to light at 550 nm; and a transparent conductor area provided over at least a portion of one side of the support. The transparent conductor area includes: first metallic micro-wires provided in a first pattern, the first conductive micro-wires having a first height and a width in a range from 0.5 um to 20 um; second metallic micro-wires provided in a second pattern having a second height that is greater than the first height and a width in a range from 0.5 um to 20. The metallic micro-wires occupy an area less than 15% of the transparent conductor area.

Abstract translation: 电子器件包括对550nm的光具有大于80％的透射率的支持体; 以及设置在支撑体的一侧的至少一部分上的透明导体区域。 所述透明导体区域包括：以第一图案设置的第一金属微细线，所述第一导电微细线具有0.5μm至20μm的第一高度和宽度; 第二金属微线以第二高度设置，第二高度大于第一高度，宽度范围为0.5μm至20μm。金属微线占透明导体面积的15％以下 。

公开(公告)号：US20130222325A1

公开(公告)日：2013-08-29

申请号：US13406649

申请日：2012-02-28

Applicant: RONALD Steven COK

Inventor： RONALD Steven COK

IPC: G06F3/044 ,  H03K17/975

CPC classification number: G06F3/044 ,  G06F2203/04103

Abstract: A touch-responsive capacitive apparatus includes a transparent substrate having electrically connected first pad micro-wires and electrically connected first interstitial micro-wires formed in a first micro-wire layer. The first pad micro-wires are electrically connected to the first interstitial wires. Electrically connected second pad micro-wires and electrically connected second interstitial micro-wires are formed in a second micro-wire layer. The second pad micro-wires are electrically connected to the second interstitial wires. The first or second micro-wire layers are supported by the transparent substrate and pairs of first and second pad areas define corresponding touch-responsive capacitors. A first interstitial micro-pattern is dissimilar from a first pad micro-pattern or a second interstitial micro-pattern is dissimilar from a second pad micro-pattern.

Abstract translation: 触控电容式设备包括具有电连接的第一焊盘微线和电连接的形成在第一微线层中的第一间隙微细线的透明衬底。 第一衬垫微线电连接到第一间隙电线。 电连接的第二焊盘微线和电连接的第二间隙微细线形成在第二微线层中。 第二衬垫微线电连接到第二间隙电线。 第一或第二微线层由透明衬底支撑，并且第一和第二焊盘区域对限定相应的触摸响应电容器。 第一间隙微图案与第一垫微图案不相似，或者第二间隙微图案与第二垫微图案不相似。

公开(公告)号：US20130222326A1

公开(公告)日：2013-08-29

申请号：US13406658

申请日：2012-02-28

Applicant: RONALD Steven COK

Inventor： RONALD Steven COK

IPC: G06F3/044 ,  H05K13/04

CPC classification number: G06F3/044 ,  G06F2203/04112

Abstract: A touch-responsive capacitive apparatus includes a transparent substrate having first and second pad and interstitial areas. Pairs of first and second pad areas define corresponding touch-responsive capacitors. Electrically connected first pad micro-wires are formed in the first pad areas and electrically connected first interstitial micro-wires are formed in the first interstitial areas. The first pad micro-wires are electrically connected to the first interstitial wires. Electrically connected second pad micro-wires are formed in the second pad areas and electrically connected second interstitial micro-wires are formed in the second interstitial areas. The second pad micro-wires are electrically connected to the second interstitial wires. The height of at least a portion of the first interstitial micro-wires is greater than the height of at least a portion of the first pad micro-wires.

Abstract translation: 触摸式电容式设备包括具有第一和第二焊盘和间隙区域的透明衬底。 成对的第一和第二焊盘区域定义相应的触摸响应电容器。 电连接的第一焊盘微线形成在第一焊盘区域中，并且电连接的第一间隙微细线形成在第一间隙区域中。 第一衬垫微线电连接到第一间隙电线。 电连接的第二焊盘微线形成在第二焊盘区域中，并且电连接的第二间隙微细线形成在第二间隙区域中。 第二衬垫微线电连接到第二间隙电线。 第一间隙微细线的至少一部分的高度大于第一焊盘微线的至少一部分的高度。

公开(公告)号：US20130048868A1

公开(公告)日：2013-02-28

申请号：US13214550

申请日：2011-08-22

Applicant: RONALD Steven COK

Inventor： RONALD Steven COK

IPC: G01T1/24 ,  H01L31/18

CPC classification number: H01L27/14612 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14683

Abstract: A method of making a radiation-sensitive apparatus includes providing a first substrate, forming a radiation-sensitive layer over the first substrate, providing a plurality of spatially separated integrated circuits, each integrated circuit having: a second substrate, one or more electronic circuit(s) formed in or on the second substrate, and one or more electrode connection pads formed in or on the second substrate, each electrode connection pad electrically connected to at least one of the electronic circuit(s). A plurality of pixel electrodes is formed over the first substrate separate from the integrated circuit, each pixel electrode electrically connected to an electrode connection pad. An electronic control circuit is electrically connected to each electronic circuit in each integrated circuit. The electronic circuits are responsive to electrical signals formed by the interaction of electromagnetic radiation and the radiation-sensitive layer, the electrical signals conducted by the pixel electrodes and electrode connection pads.

Abstract translation: 一种制造辐射敏感设备的方法包括提供第一衬底，在第一衬底上形成辐射敏感层，提供多个空间分离的集成电路，每个集成电路具有：第二衬底，一个或多个电子电路 形成在所述第二基板中或上的一个或多个电极连接焊盘，以及形成在所述第二基板中或所述第二基板上的一个或多个电极连接焊盘，每个电极连接焊盘电连接到所述电子电路中的至少一个。 在与集成电路分离的第一基板上形成多个像素电极，每个像素电极电连接到电极连接焊盘。 电子控制电路与每个集成电路中的每个电子电路电连接。 电子电路响应于由电磁辐射和辐射敏感层的相互作用形成的电信号，由像素电极和电极连接焊盘传导的电信号。