公开(公告)号：US07462294B2

公开(公告)日：2008-12-09

申请号：US11739701

申请日：2007-04-25

Applicant: Rajneesh Kumar ,  Steven P Ostrander

Inventor： Rajneesh Kumar ,  Steven P Ostrander

IPC: C09K5/08 ,  C09K5/10 ,  C09K5/14 ,  H01B1/00 ,  H05K7/20

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract translation: 提供了一种导热混合物，其用于制备导热配方，例如具有高导热性和较低粘度的糊状物。 该糊料用于在电子部件和冷却装置之间提供热导体连接，以增加部件和冷却电子部件的装置之间的传热速率。 制剂含有各种粒度范围内的导热颗粒的混合物，通常分散在含有抗氧化剂和分散剂的非水电介质载体中，导热颗粒混合物在混合物中基于粒度范围以体积百分数特别相关， 通过颗粒尺寸比各个粒径范围。 该混合物可用于制造其他类似产品，例如热凝胶，粘合剂，浆料和复合材料，用于电子和化妆品，药​​品，汽车和类似产品。