公开(公告)号：US20240247120A1

公开(公告)日：2024-07-25

申请号：US18562166

申请日：2022-05-30

Applicant: Resonac Corporation

Inventor： Shunsuke TONOUCHI ,  Takayo KITAJIMA ,  Seiya MAGOTA ,  Kazuki AOYAMA ,  Shinji SHIMAOKA ,  Yuji TOSAKA ,  Takeshi SAITOH ,  Ryohta SASAKI ,  Kota NAKANISHI

IPC: C08J5/24 ,  H05K1/03

CPC classification number: C08J5/244 ,  H05K1/0366 ,  C08J2333/24 ,  C08J2363/04 ,  C08J2461/06 ,  C08J2463/00

Abstract: Provided is a prepreg including a fiber substrate having a thickness of 40 μm or more impregnated with a thermosetting resin composition, the prepreg having in the fiber substrate an impregnated region and a non-impregnated region with the thermosetting resin composition, having a surface waviness (Wa) of 5.0 μm or less. Also provided are a laminate, a metal-clad laminate, a printed wiring board, and a semiconductor package, which are obtained by using the prepreg, a method of producing the prepreg, and a method of producing the metal-clad laminate.