公开(公告)号：US12110390B2

公开(公告)日：2024-10-08

申请号：US17054286

申请日：2019-05-10

申请人： SAMYANG CORPORATION

发明人： Gwang Seok Song ,  Hoon Ryu ,  Jun Seop Im ,  Seung Hyun Yoo ,  Won Hyun Jeon

IPC分类号： C08L75/08 ,  C08J3/09 ,  C08K3/04 ,  C08L63/00 ,  C09K23/00

CPC分类号： C08L75/08 ,  C08J3/095 ,  C08K3/042 ,  C08L63/00 ,  C09K23/00 ,  C08J2301/02 ,  C08J2363/00 ,  C08J2375/08 ,  C08J2401/02 ,  C08J2463/00 ,  C08J2475/08 ,  C08L2205/16

摘要： The present invention relates to a solid dispersion, a preparation method therefor, a chain-extended polyurethane using same, and an epoxy resin composition comprising same and, more particularly, to a solid dispersion in which an inorganic or organic material-derived isotropic or anisotropic substance is used as a dispersoid and dispersed at room temperature in a solid-phase dispersion medium such as polyols and sugars, whereby the dispersion can be easily stored and used, reduce transportation cost, prevent or alleviate the aggregation or precipitation caused during the storage of products, with the results of working efficiency improvement and processing cost reduction, and, when applied to polyurethane, can increase strength and provide an improved strength, compared to conventional curing agent, a preparation method therefor, a chain-extended polyurethane using same, and an epoxy resin composition comprising same.

公开(公告)号：US20240247120A1

公开(公告)日：2024-07-25

申请号：US18562166

申请日：2022-05-30

申请人： Resonac Corporation

发明人： Shunsuke TONOUCHI ,  Takayo KITAJIMA ,  Seiya MAGOTA ,  Kazuki AOYAMA ,  Shinji SHIMAOKA ,  Yuji TOSAKA ,  Takeshi SAITOH ,  Ryohta SASAKI ,  Kota NAKANISHI

IPC分类号： C08J5/24 ,  H05K1/03

CPC分类号： C08J5/244 ,  H05K1/0366 ,  C08J2333/24 ,  C08J2363/04 ,  C08J2461/06 ,  C08J2463/00

摘要： Provided is a prepreg including a fiber substrate having a thickness of 40 μm or more impregnated with a thermosetting resin composition, the prepreg having in the fiber substrate an impregnated region and a non-impregnated region with the thermosetting resin composition, having a surface waviness (Wa) of 5.0 μm or less. Also provided are a laminate, a metal-clad laminate, a printed wiring board, and a semiconductor package, which are obtained by using the prepreg, a method of producing the prepreg, and a method of producing the metal-clad laminate.

公开(公告)号：US12030295B2

公开(公告)日：2024-07-09

申请号：US16889128

申请日：2020-06-01

申请人： SUBARU CORPORATION

发明人： Naoyuki Sekine ,  Yuta Inoue

IPC分类号： B32B5/26 ,  B29C70/74 ,  B29K63/00 ,  B29K105/08 ,  B29K277/00 ,  B32B5/02 ,  B32B7/09 ,  B32B27/34 ,  B32B37/02 ,  B32B38/00 ,  C08J5/24

CPC分类号： B32B5/26 ,  B29C70/745 ,  B32B5/024 ,  B32B5/026 ,  B32B7/09 ,  B32B27/34 ,  B32B37/02 ,  B32B38/0036 ,  C08J5/247 ,  C08J5/249 ,  B29K2063/00 ,  B29K2105/089 ,  B29K2277/00 ,  B32B2038/0076 ,  B32B2260/046 ,  B32B2262/0261 ,  B32B2363/00 ,  C08J2379/04 ,  C08J2463/00 ,  C08J2477/06

摘要： A fiber-reinforced resin composite material includes first and second members. The first member includes a first fiber and a first matrix resin. The first fiber includes a reinforcing fiber and is impregnated with the first matrix resin. The reinforcing fiber has a melting point and a tensile strength higher than those of an aliphatic polyamide fiber. The second member includes a stack and a second matrix resin. The stack includes a second fiber and a third fiber filled with the second matrix resin. The second fiber includes the reinforcing fiber. The second matrix resin includes a component common to that of the first matrix resin, and includes a first polyamide resin that includes an aliphatic polyamide resin. The third fiber includes a second polyamide resin that includes an aliphatic polyamide resin and has a melting point higher than that of the first polyamide resin by 7 to 50 degrees centigrade.

公开(公告)号：US20240136454A1

公开(公告)日：2024-04-25

申请号：US18071591

申请日：2022-11-29

申请人： NAN YA PLASTICS CORPORATION

发明人： TE-CHAO LIAO ,  CHING-YAO YUAN ,  Yu-Chi Hsieh

IPC分类号： H01L31/049 ,  B32B27/12 ,  B32B27/30 ,  C08J5/24 ,  C09D127/14

CPC分类号： H01L31/049 ,  B32B27/12 ,  B32B27/304 ,  C08J5/244 ,  C09D127/14 ,  B32B5/022 ,  C08J2363/00 ,  C08J2463/00

摘要： A back panel of a solar cell and a method for manufacturing the same are provided. The back panel includes a prepreg and a fluorine-containing polymer layer, and the fluorine-containing polymer layer is formed on the prepreg. The prepreg is formed by immersing a fiber substrate into a resin composition. Based on a total weight of the resin composition being 100 PHR (parts per hundred resin), the resin composition includes: 5 PHR to 70 PHR of a first epoxy resin, 1 PHR to 20 PHR of a hardener, and 0.01 PHR to 10 PHR of an accelerant. The first epoxy resin contains phosphorus atoms, and an amount of the phosphorus atoms in the first epoxy resin ranges from 0.1 wt % to 5 wt %.

公开(公告)号：US11912859B2

公开(公告)日：2024-02-27

申请号：US16973768

申请日：2019-06-17

申请人： TORAY INDUSTRIES, INC.

发明人： Daisuke Konishi ,  Yuichi Yamakita ,  Noriyuki Hirano ,  Eiki Takahashi

IPC分类号： C08L63/00 ,  C08J5/24

CPC分类号： C08L63/00 ,  C08J5/243 ,  C08J5/249 ,  C08J2363/00 ,  C08J2463/00 ,  C08J2481/06 ,  C08L2205/025 ,  C08L2205/035

摘要： The purpose of the present invention is to provide: an epoxy resin composition capable of giving cured resins which combine flexural modulus with flexural strain on a high level and have excellent heat resistance; a prepreg comprising the epoxy resin composition and reinforcing fibers; and a fiber-reinforced composite material obtained by curing the prepreg and excellent especially in terms of 0° and 90° bending strength. An embodiment of the epoxy resin composition of the present invention for achieving such purpose is an epoxy resin composition which comprises the following components [A], [B], and [C] and satisfies a specific requirement. Component [A]: a trifunctional amine type epoxy resin. Component [B]: a bisphenol F type epoxy resin which is solid at 25° C. Component [C]: an aromatic amine compound.

公开(公告)号：US11851534B2

公开(公告)日：2023-12-26

申请号：US17020357

申请日：2020-09-14

申请人： SRAM, LLC

发明人： Hung I Chen ,  Chia-Chang Chang ,  Ching-Han Liu ,  Huan-Ching Hsu

IPC分类号： C08J11/04

CPC分类号： C08J11/04 ,  C08J2363/00 ,  C08J2375/00 ,  C08J2463/00 ,  C08J2475/00

摘要： A method for preparing a fiber-containing molding compound includes the acts of a) providing a composite material which includes a first resin and fibers impregnated with the first resin, and b) mixing the composite material with a treatment medium which includes a diluent to form a mixture. The fiber-containing molding compound thus prepared has an adjustable fiber content.

公开(公告)号：US20230357561A1

公开(公告)日：2023-11-09

申请号：US18206386

申请日：2023-06-06

申请人： Toray Industries, Inc.

发明人： Hiroshi Kobayashi ,  Taiki Maeyama ,  Hiroaki Sakata

IPC分类号： C08L63/00 ,  C08J5/24

CPC分类号： C08L63/00 ,  C08J5/243 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2463/00 ,  C08J2463/02 ,  C08J2481/06 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035

摘要： A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×103 to 2.0×108 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin comprising a m- or p-aminophenol epoxy resin [b1] and either a glycidyl ether epoxy resin or a glycidyl amine epoxy resin [b2] that has two or more glycidyl groups in a molecule, [C] curing agent, and [D] thermoplastic resin.

公开(公告)号：US11732105B2

公开(公告)日：2023-08-22

申请号：US17513432

申请日：2021-10-28

申请人： DEXERIALS CORPORATION

发明人： Yasushi Akutsu ,  Reiji Tsukao

IPC分类号： C08K3/013 ,  C08J3/20 ,  C08J5/18 ,  B32B5/16 ,  B32B27/20 ,  H01R11/01 ,  C08K7/16 ,  H01L23/00 ,  H05K3/32 ,  B29C59/02 ,  B29C70/64 ,  C08K5/00 ,  C08K7/00 ,  B29L7/00 ,  C09J9/02 ,  H01B5/16 ,  C09J7/10

CPC分类号： C08K3/013 ,  B29C59/02 ,  B29C70/64 ,  B32B27/20 ,  C08J3/20 ,  C08J5/18 ,  C08K5/00 ,  C08K7/00 ,  C08K7/16 ,  H01L24/29 ,  H05K3/323 ,  B29C2059/028 ,  B29K2905/08 ,  B29L2007/008 ,  B32B5/16 ,  B32B2264/02 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/202 ,  B32B2264/302 ,  B32B2264/303 ,  B32B2264/305 ,  B32B2264/403 ,  B32B2264/501 ,  B32B2264/504 ,  B32B2307/202 ,  B32B2405/00 ,  B32B2457/00 ,  C08J2333/10 ,  C08J2371/12 ,  C08J2463/00 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/02 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2301/412 ,  H01B5/16 ,  H01L2924/07811 ,  H01R11/01 ,  Y10S428/906 ,  Y10T428/24521 ,  Y10T428/24545 ,  Y10T428/24612 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/28

摘要： A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

公开(公告)号：US20180258245A1

公开(公告)日：2018-09-13

申请号：US15455734

申请日：2017-03-10

申请人： Armacell Enterprise GmbH & Co. KG

发明人： Christoph ZAUNER ,  Miroslav BETTERMANN

IPC分类号： C08J9/00 ,  C08J9/10

CPC分类号： C08J9/0061 ,  C08J9/0014 ,  C08J9/0019 ,  C08J9/0023 ,  C08J9/0038 ,  C08J9/0066 ,  C08J9/0095 ,  C08J9/103 ,  C08J2201/026 ,  C08J2201/03 ,  C08J2205/052 ,  C08J2205/06 ,  C08J2309/02 ,  C08J2311/00 ,  C08J2400/102 ,  C08J2409/00 ,  C08J2423/28 ,  C08J2427/06 ,  C08J2431/04 ,  C08J2463/00 ,  C08J2471/12

摘要： An expanded polymeric material which consists of at least 200 phr, preferably at least 300 phr, but less than 1000 phr, preferably less than 700 phr ingredients in total, comprising 100 phr of at least one polymer, of which at least one is a sulphur and/or metal oxide crosslinkable elastomer and at least 40 phr, preferably at least 55 phr of at least one polymeric flame retardant, preferably a brominated polymeric flame retardant.

公开(公告)号：US20180201778A1

公开(公告)日：2018-07-19

申请号：US15743715

申请日：2016-07-05

申请人： WinTech Polymer Ltd.

发明人： Shotaro Moriya ,  Kouichi Sakata

IPC分类号： C08L67/02 ,  C08J3/20

CPC分类号： C08L67/02 ,  C08J3/203 ,  C08J2367/02 ,  C08J2433/08 ,  C08J2463/00 ,  C08K7/14 ,  C08L23/08 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/03 ,  C08L23/0869

摘要： A polybutylene terephthalate resin composition containing a polybutylene terephthalate resin, 10 to 20% by mass of glass fiber relative to a total mass of the composition, an ethylene/ethyl acrylate copolymer, and an epoxy compound having an epoxy equivalent weight of 600 to 1,500 g/equivalent, and having a comparative tracking index (CTI) of 600 V or higher, measured in accordance with the third edition of IEC 60112.