公开(公告)号：US20060025005A1

公开(公告)日：2006-02-02

申请号：US10901338

申请日：2004-07-28

申请人： Richard Olson ,  Jill Quinn ,  Stacy Fraker ,  Jeffrey Deeney ,  Joseph Dutson

发明人： Richard Olson ,  Jill Quinn ,  Stacy Fraker ,  Jeffrey Deeney ,  Joseph Dutson

IPC分类号： H01R13/62

CPC分类号： H01R13/5213

摘要： A shroud for a circuit board having a raised pin platform and a pin array projecting from the raised pin platform. A spacer extending from a side wall of the shroud engages a side of the raised pin platform, thereby accurately aligning the shroud with the pin platform

摘要翻译： 一种用于电路板的护罩，其具有凸起销平台和从凸起销平台突出的销阵列。 从护罩的侧壁延伸的间隔件接合凸起销平台的侧面，从而将护罩与销平台精确对准

公开(公告)号：US06695042B1

公开(公告)日：2004-02-24

申请号：US10209981

申请日：2002-07-31

申请人： Brent A. Boudreaux ,  Stacy Fraker ,  Eric C. Peterson ,  Christian L. Belady

发明人： Brent A. Boudreaux ,  Stacy Fraker ,  Eric C. Peterson ,  Christian L. Belady

IPC分类号： F28D1500

CPC分类号： F28F13/00 ,  F28F2013/006 ,  H01L21/4882 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.

摘要翻译： 构造了散热器，其包括至少一个导热基座，允许散热器的配置与多个发热电子器件接触，其中由于公差叠加，器件可能不是共面的。 基座可以根据需要升高和降低并倾斜以匹配电子设备的高度和倾斜度。 在散热器内部是在基座上方的空腔，其可以在构造期间填充有导热材料，例如焊料或导热液体，以在基座和散热鳍片之间产生低热阻接触。 此外，可以在发热装置和基座之间使用导热材料，例如热膏或热垫，以产生低热阻接触。

公开(公告)号：US06625026B1

公开(公告)日：2003-09-23

申请号：US10210000

申请日：2002-07-31

申请人： Brent A. Boudreaux ,  Stacy Fraker ,  Roy M. Zeighami ,  Eric C. Peterson ,  Christian L. Belady

发明人： Brent A. Boudreaux ,  Stacy Fraker ,  Roy M. Zeighami ,  Eric C. Peterson ,  Christian L. Belady

IPC分类号： H05K720

CPC分类号： F28F13/00 ,  F28F2013/005 ,  H01L21/4882 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.

摘要翻译： 热激活的自对准散热器是将至少一个基板上的发热装置热连接到散热体上，其中发热装置可能由于公差叠加而彼此不共面 或与散热器主体平行。 基座附接到基板以支撑散热体。 插头或浮动底座放置在每个发热装置的顶部并且保持在基座内，允许足够的运动使插塞的底表面完全接触发热装置的顶表面。 将一定数量的低熔点温度的导热材料，例如焊料或导热液体放置在每个塞子上，并将散热器主体放置在组件上。 当加热时，热材料熔化，在插头和散热器本体之间形成低阻抗热连接，而与两个器件之间的平面度差异无关。