公开(公告)号：US20050036754A1

公开(公告)日：2005-02-17

申请号：US10640583

申请日：2003-08-13

申请人： Robert Monson ,  Richard Cellini ,  Jianhua Yan

发明人： Robert Monson ,  Richard Cellini ,  Jianhua Yan

IPC分类号： G02B6/42 ,  G02B6/00

CPC分类号： G02B6/4249 ,  G02B6/4228 ,  G02B6/4239 ,  G02B6/4246 ,  G02B6/4292

摘要： A method of integrating an optoelectronic device, for example a vertical cavity surface emitting laser, onto the electronic substrate of a parallel optical transceiver package by positioning and maintaining the exact relative alignment of the optoelectronic device relative to the electronic substrate for application of adhesive and curing. The method includes the utilization of a multi-piece fixture which clamps the elements into position and maintains position throughout the curing process. Alternatively, the fixture can comprise a unitary assembly for clamping the elements into position and maintaining their position throughout the curing process.

摘要翻译： 通过定位和保持光电子器件相对于电子基片的精确相对对准来将光电器件（例如垂直腔表面发射激光器）集成到并行光收发器封装的电子衬底上的方法，用于施加粘合剂和固化 。 该方法包括利用多片固定装置，其将元件夹持在适当的位置并且在整个固化过程中保持位置。 或者，夹具可以包括用于将元件夹持在适当位置并在整个固化过程中保持其位置的整体组件。