公开(公告)号：US12080977B2

公开(公告)日：2024-09-03

申请号：US17701837

申请日：2022-03-23

Applicant: HANGZHOU MO-LINK TECHNOLOGY CO. LTD

Inventor： Cheng Zhi Mo ,  Qi Chen ,  Hao Wang ,  Fengfeng Yang

IPC: H01R13/66 ,  G02B6/42 ,  H01R13/50 ,  H01R13/6581 ,  H01R43/18

CPC classification number: H01R13/6691 ,  G02B6/425 ,  H01R13/50 ,  H01R13/6581 ,  H01R43/18 ,  G02B6/423 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/428 ,  H01R13/665 ,  H01R13/6658 ,  H05K2201/10121

Abstract: The present disclosure describes a signal transmission device based on molded interconnect device and laser direct structuring (MID/LDS) technology, comprising: a shielding shell (1); and a photoelectric conversion module (2), which includes a carrier (21), an electrical module (22) and an optical module (23). The photoelectric conversion module (2) is fixed inside the shielding shell (1), wherein the first recessed structure (201) accommodates a driving chip (211), a photoelectric conversion chip (212) and an optical module (23), and the second recessed structure (202) accommodates an electrical module (22), the driving chip (211), the photoelectric conversion chip (212) and the conductive terminal (215) are electrically connected to each other, and the carrier (21) is designed by integral molding based on the MID/LDS technology. In t present disclosure, the design space in the shielding shell can be effectively saved.

公开(公告)号：US11994727B2

公开(公告)日：2024-05-28

申请号：US18139978

申请日：2023-04-27

Applicant: ENERGY FULL ELECTRONICS CO., LTD.

Inventor： Hsu-Shen Chin

IPC: G02B6/44 ,  G02B6/42 ,  F21V8/00

CPC classification number: G02B6/4416 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/001

Abstract: A light-emitting cable structure includes a light-emitting cable, a first circuit board, second circuit board, at least one light-emitting module and a covering casing. By placing a plurality of signal groups in the light-emitting cable below a plurality of optical fibers in the light-emitting cable for a certain distance and placing the signal groups outside the vertical projection of the optical fibers towards the signal groups, the light in the optical fibers is allowed to be emitted by the vertical projection, so that users can observe the light transmitted in the optical fibers from all sides of the light-emitting cable structure, which greatly increases the attractiveness of the product to consumers.

公开(公告)号：US20240118505A1

公开(公告)日：2024-04-11

申请号：US18484891

申请日：2023-10-11

Applicant: Teramount Ltd.

Inventor： Hesham Taha ,  Abraham Israel

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/124 ,  G02B6/13 ,  G02B6/136 ,  G02B6/26 ,  G02B6/30 ,  G02B6/43

CPC classification number: G02B6/4214 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/136 ,  G02B6/262 ,  G02B6/30 ,  G02B6/4206 ,  G02B6/4228 ,  G02B6/4292 ,  G02B6/43 ,  G02B6/4238 ,  G02B6/4243 ,  G02B6/4249 ,  G02B6/4274

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

公开(公告)号：US20240077689A1

公开(公告)日：2024-03-07

申请号：US18139978

申请日：2023-04-27

Applicant: ENERGY FULL ELECTRONICS CO.,LTD.

Inventor： Hsu-Shen CHIN

IPC: G02B6/44 ,  G02B6/42

CPC classification number: G02B6/4416 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/001

Abstract: A light-emitting cable structure includes a light-emitting cable, a first circuit board, second circuit board, at least one light-emitting module and a covering casing. By placing a plurality of signal groups in the light-emitting cable below a plurality of optical fibers in the light-emitting cable for a certain distance and placing the signal groups outside the vertical projection of the optical fibers towards the signal groups, the light in the optical fibers is allowed to be emitted by the vertical projection, so that users can observe the light transmitted in the optical fibers from all sides of the light-emitting cable structure, which greatly increases the attractiveness of the product to consumers.

公开(公告)号：US11921331B2

公开(公告)日：2024-03-05

申请号：US17101351

申请日：2020-11-23

Applicant: Enplas Corporation

Inventor： Takahiro Izawa ,  Akinobu Seki

IPC: G02B6/42 ,  G02B5/18 ,  G02B6/43 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/02255 ,  G02B27/09 ,  H01S5/42

CPC classification number: G02B6/4204 ,  G02B5/1814 ,  G02B6/4206 ,  G02B6/4246 ,  G02B5/1876 ,  G02B6/4214 ,  G02B6/4244 ,  G02B6/4249 ,  G02B2006/4297 ,  G02B6/43 ,  G02B27/0916 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/423

Abstract: An optical receptacle including a first optical surface configured to allow incidence of light emitted from the light emitting element; a second optical surface configured to emit, toward the optical transmission member, light emitted from the light emitting element and advanced inside the optical receptacle; and a diffraction surface disposed on the first optical surface, on the second optical surface, or on a light path between the first optical surface and the second optical surface. The diffraction surface is configured such that primary diffraction light of the light emitted from the light emitting element reaches an end portion of the optical transmission member, and that zero-order diffraction light of the light emitted from the light emitting element does not reach the end portion of the optical transmission member.

公开(公告)号：US11860428B1

公开(公告)日：2024-01-02

申请号：US17835990

申请日：2022-06-09

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Tzyy-Jang Tseng

IPC: G02B6/42 ,  H01S5/42

CPC classification number: G02B6/4274 ,  G02B6/4249 ,  G02B6/4271 ,  G02B6/4295 ,  H01S5/423

Abstract: A package structure includes a circuit board, a package substrate, a fine metal L/S RDL-substrate, an electronic assembly, a photonic assembly, a heat dissipation assembly, and an optical fiber assembly. The package substrate is disposed on and electrically connected to the circuit board. The fine metal L/S RDL-substrate is disposed on and electrically connected to the package substrate. The electronic assembly includes an application specific integrated circuit (ASIC) assembly, an electronic integrated circuit (EIC) assembly, and a photonic integrated circuit (PIC) assembly which are respectively disposed on the fine metal L/S RDL-substrate and electrically connected to the package substrate by the fine metal L/S RDL-substrate. The heat dissipation assembly is disposed on the electronic assembly. The optical fiber assembly is disposed on the package substrate and electrically connected to the package substrate and the PIC assembly. A packaging method of the VCSEL array chip is presented.

公开(公告)号：US20230370170A1

公开(公告)日：2023-11-16

申请号：US18354379

申请日：2023-07-18

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC: H04B10/80 ,  H04B10/516 ,  G11C5/04 ,  G11C5/06 ,  G11C11/42 ,  G02B6/42 ,  G11C5/14

CPC classification number: H04B10/80 ,  G02B6/4249 ,  G02B6/4274 ,  G11C5/04 ,  G11C5/06 ,  G11C5/141 ,  G11C11/42 ,  H04B10/516

Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

公开(公告)号：US20230305243A1

公开(公告)日：2023-09-28

申请号：US18203302

申请日：2023-05-30

Applicant: Google LLC

Inventor： Daoyi Wang ,  Ryohei Urata ,  Lieven Verslegers ,  Jan Petykiewicz

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/30

CPC classification number: G02B6/4242 ,  G02B6/12 ,  G02B6/30 ,  G02B6/423 ,  G02B6/4249

Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

公开(公告)号：US11736192B2

公开(公告)日：2023-08-22

申请号：US17676434

申请日：2022-02-21

Applicant: CommScope Technologies LLC

Inventor： M'hamed Anis Khemakhem ,  Scott C. Kowalczyk ,  Nicholas Torman ,  Dominic J. Louwagie

IPC: H04B10/2575 ,  H04B10/80 ,  G02B6/42 ,  G02B6/44 ,  H04W88/08 ,  G02B6/38 ,  H04W88/10

CPC classification number: H04B10/25753 ,  G02B6/3897 ,  G02B6/4207 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4441 ,  G02B6/4446 ,  G02B6/4454 ,  G02B6/4457 ,  H04B10/25758 ,  H04B10/801 ,  H04W88/085 ,  G02B6/4471 ,  H04W88/10

Abstract: A cell site includes a tower, a multi-service terminal mounted to the tower and a base transceiver station in communication with the multi-service terminal. The multi-service terminal includes a housing and a plurality of adapters mounted to the housing. Each of the adapters includes an outer port accessible from outside the housing and an inner port accessible from inside the housing.

公开(公告)号：US20230251441A1

公开(公告)日：2023-08-10

申请号：US18134647

申请日：2023-04-14

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H04B10/25 ,  H04B1/3827 ,  H04B10/40 ,  H04B10/27 ,  H04B10/80 ,  H05K7/20 ,  H01R13/639 ,  H01R12/71

CPC classification number: G02B6/4284 ,  G02B6/428 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/4292 ,  G02B6/4293 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H04B10/25891 ,  H05K7/20418 ,  H01L2224/48091 ,  H01L2224/49175

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.