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公开(公告)号:US10647840B2
公开(公告)日:2020-05-12
申请号:US16300991
申请日:2017-05-25
Applicant: SABIC Global Technologies B.V.
Inventor: Jian Wang , Shijie Song , Zhenke Wei , Qin Wang , Mian Dai
Abstract: A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.
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公开(公告)号:US10604646B2
公开(公告)日:2020-03-31
申请号:US16300991
申请日:2017-05-25
Applicant: SABIC Global Technologies B.V.
Inventor: Jian Wang , Shijie Song , Zhenke Wei , Qin Wang , Mian Dai
Abstract: A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.
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