公开(公告)号：US20240120311A1

公开(公告)日：2024-04-11

申请号：US18230825

申请日：2023-08-07

Applicant: Samsung Display Co., LTD.

Inventor： FUTOSHI YOSHIDA ,  JONGHYUP KIM ,  JUN HA PARK ,  JINPYUNG LEE ,  DONGHYUN HAN

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2924/401

Abstract: A bonding apparatus includes: a chamber including a light transmission part configured to transmit light irradiated onto a substrate on which at least one chip is disposed; and a light generation part disposed on the chamber and configured to irradiate the light. The light transmission part may include an absorption prevention layer, in which a plurality of through-holes are defined, and a light diffusion layer that diffuses the light passing through the plurality of through-holes to reduce heat generation in the light transmission part and uniformly irradiate the light passing through the light transmission part onto the substrate on which at least one chip is disposed.

公开(公告)号：US20190308276A1

公开(公告)日：2019-10-10

申请号：US16375582

申请日：2019-04-04

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： TOSHINARU SUZUKI ,  DOKYUN KWON ,  JAEBUM PAHK ,  JINWON BAEK ,  JEONGHO YI ,  JINPYUNG LEE ,  KYONGHO HONG

IPC: B23K26/38 ,  H01L21/687 ,  B23K26/70

Abstract: A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.