公开(公告)号：US20240120311A1

公开(公告)日：2024-04-11

申请号：US18230825

申请日：2023-08-07

Applicant: Samsung Display Co., LTD.

Inventor： FUTOSHI YOSHIDA ,  JONGHYUP KIM ,  JUN HA PARK ,  JINPYUNG LEE ,  DONGHYUN HAN

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2924/401

Abstract: A bonding apparatus includes: a chamber including a light transmission part configured to transmit light irradiated onto a substrate on which at least one chip is disposed; and a light generation part disposed on the chamber and configured to irradiate the light. The light transmission part may include an absorption prevention layer, in which a plurality of through-holes are defined, and a light diffusion layer that diffuses the light passing through the plurality of through-holes to reduce heat generation in the light transmission part and uniformly irradiate the light passing through the light transmission part onto the substrate on which at least one chip is disposed.