Patent search ap:("SAMSUNG ELECTRO-MECHANICS CO. Page LTD.") AND inv:"Cheol Min BAE"

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发明申请
COMPOSITION FOR ELECTROLESS COPPER PLATING AND METHOD FOR ELECTROLESS PLATING USING THE SAME 有权

公开(公告)号：US20210047735A1

公开(公告)日：2021-02-18

申请号：US16742647

申请日：2020-01-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Sub SIN , Su Jin LEE , Cheol Min BAE , Cheol Min KIM

IPC: C23C18/38

Abstract: The present disclosure relates to an electroless copper plating composition and an electroless plating method and a product using the same.

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