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公开(公告)号:US20240258030A1
公开(公告)日:2024-08-01
申请号:US18635700
申请日:2024-04-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dae Woo YOON , Su Jin LEE , Da Mi KIM , Bum Suk KANG , Seong Han PARK , Jeong Ryeol KIM
CPC classification number: H01G4/008 , C03C3/066 , C03C3/093 , C03C4/14 , C03C8/04 , C03C8/18 , H01G4/248 , C03C2204/00 , H01G4/30
Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.
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公开(公告)号:US20240161976A1
公开(公告)日:2024-05-16
申请号:US18121247
申请日:2023-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dae Woo YOON , Bum Suk KANG , Da Mi KIM , Su Jin LEE
CPC classification number: H01G4/008 , H01G4/012 , H01G4/1227 , H01G4/30
Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.
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公开(公告)号:US20160104578A1
公开(公告)日:2016-04-14
申请号:US14878868
申请日:2015-10-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Bum Suk KANG , Su Jin LEE , Hew Young KIM , Hee Sang KANG , Woo Sup KIM , Seong Min CHIN
CPC classification number: H01G4/30 , H01G4/0085 , H01G4/1227 , H01G4/2325
Abstract: The present invention relates to a multi-layer ceramic capacitor which includes a ceramic main body formed by stacking internal electrodes and dielectric layers alternately and an external electrode formed by stacking a coating layer and a plating layer on both ends of the ceramic main body sequentially, wherein the coating layer includes conductive metal powder and a(Si, B)-b(Li, K)-c(Ba, Ca)-d(Mn, V, Zn)-e(Ti, Sn, Zr, Al) component of glass frit (herein, 20≦a≦60, 10≦b≦35, 2≦c≦30, 2≦d≦20 and 0.5≦e≦30 mol %, a+b+c+d=100 mol %).
Abstract translation: 多层陶瓷电容器技术领域本发明涉及一种多层陶瓷电容器,其包括通过交替堆叠内部电极和电介质层而形成的陶瓷主体,以及通过依次堆叠陶瓷主体的两端上的涂层和镀层而形成的外部电极, 其中所述涂层包括导电金属粉末和(Si,B)-b(Li,K)-c(Ba,Ca)-d(Mn,V,Zn)-e(Ti,Sn,Zr,Al)组分 的玻璃料(本文中为20< nlE; a≦̸ 60,10和nlE; b≦̸ 35,2和nlE; 30,2和nlE; 20和0.5和nlE; e≦̸ 30mol%,a + b + c + d = )。
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公开(公告)号:US20240222028A1
公开(公告)日:2024-07-04
申请号:US18127808
申请日:2023-03-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Da Mi KIM , Bum Suk KANG , Su Jin LEE , Dae Woo YOON
CPC classification number: H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
Abstract: A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the third and fourth surfaces of the body and connected to the internal electrodes. At least one of the internal electrodes includes an interfacial layer disposed on at least a portion of a region connected to the external electrode, and the interfacial layer includes an oxide containing Fe.
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公开(公告)号:US20230133669A1
公开(公告)日:2023-05-04
申请号:US17702223
申请日:2022-03-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dae Woo YOON , Su Jin LEE , Da Mi KIM , Bum Suk KANG , Seong Han PARK , Jeong Ryeol KIM
Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.
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6.
公开(公告)号:US20240420895A1
公开(公告)日:2024-12-19
申请号:US18814950
申请日:2024-08-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Bum Suk KANG , Su Jin LEE , Dae Woo YOON , Da Mi KIM , Jeong Ryeol KIM
Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.
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公开(公告)号:US20230162921A1
公开(公告)日:2023-05-25
申请号:US17707390
申请日:2022-03-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Bum Suk KANG , Su Jin LEE , Dae Woo YOON , Da Mi KIM , Jeong Ryeol KIM
Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.
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8.
公开(公告)号:US20210047735A1
公开(公告)日:2021-02-18
申请号:US16742647
申请日:2020-01-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Young Sub SIN , Su Jin LEE , Cheol Min BAE , Cheol Min KIM
IPC: C23C18/38
Abstract: The present disclosure relates to an electroless copper plating composition and an electroless plating method and a product using the same.
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