MULTILAYER CERAMIC ELECTRONIC COMPONENT
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开
    多层陶瓷电子元件

    公开(公告)号:US20130242459A1

    公开(公告)日:2013-09-19

    申请号:US13887263

    申请日:2013-05-03

    CPC classification number: H01G4/30 H01G4/012 H01G4/1209

    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer having an average thickness of 0.6 μm or less; and first and second inner electrode layers within the ceramic body, disposed to face each other with the dielectric layer interposed therebetween, wherein the dielectric layer includes contact dielectric grains in contact with the first or second inner electrode layer and non-contact dielectric grains not in contact with the first or second inner electrode layer, and, when an average thickness of the dielectric layer is defined as td and an average diameter of the contact dielectric grains is defined as De, De/td≦0.35 is satisfied. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability.

    Abstract translation: 提供了一种多层陶瓷电子部件,其包括:陶瓷体,其包括平均厚度为0.6μm以下的电介质层; 以及陶瓷体内的第一和第二内部电极层,被设置为彼此相对地插入介电层,其中介电层包括与第一或第二内部电极层接触的接触电介质晶粒和不在 与第一或第二内部电极层接触,并且当电介质层的平均厚度被定义为td,并且接触介电晶粒的平均直径被定义为De时,满足De/td@0.35。 多层陶瓷电子部件具有改善的内部电极层的连续性,大的电容,延长的加速寿命和优异的可靠性。

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