公开(公告)号：US20240275638A1

公开(公告)日：2024-08-15

申请号：US18629184

申请日：2024-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohun KIM ,  Kyujae JANG ,  Jaemoon CHA ,  Jimin KOO ,  Jaegon GHIM ,  Jungsuk WOO ,  Yeonsang YUN ,  Kwangsu LEE ,  Deokhee LEE ,  Sangdon LEE ,  Yeonjoo LEE ,  Sanghyun CHANG ,  Sungyoul CHO ,  Hyunkyung JO

IPC: H04L25/02 ,  H04L5/00

CPC classification number: H04L25/0204 ,  H04L5/0023 ,  H04L5/0048

Abstract: Disclosed are a transmission power control method and an electronic device for performing the same. The transmission power control method according to various embodiments may comprise: determining whether the magnitude of a reference signal received from a first base station for transmitting and receiving a first signal is greater than or equal to a set magnitude; determining a ratio of a specific absorption rate of the first signal according to a ratio set in the total specific absorption rate margin; and transmitting the first signal on the basis of the ratio of the specific absorption rate of the first signal.

公开(公告)号：US20230422419A1

公开(公告)日：2023-12-28

申请号：US18216530

申请日：2023-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungseon HWANG ,  Deokhee LEE ,  Sunggyu LEE

IPC: H04M1/02

CPC classification number: H04M1/0283

Abstract: An electronic device includes a housing forming the exterior of the electronic device, the housing comprising: a base material forming the shape of the housing; a first layer positioned on one surface of the base material and containing a color paint; and a second layer positioned on one surface of the first layer and containing a visible light-transmitting material, wherein the second layer contains an infrared absorbing material, and the second layer may include a marking region on a surface exposed to the outside of the housing.

公开(公告)号：US20220057846A1

公开(公告)日：2022-02-24

申请号：US17521186

申请日：2021-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungseon HWANG ,  Deokhee LEE ,  Sunggyu LEE

IPC: G06F1/16 ,  G06K9/00

Abstract: An electronic device is provided. The electronic device includes a housing and a sensor module disposed in at least a portion of the housing. The sensor module includes a fingerprint recognition sensor, a protective layer covering the fingerprint recognition sensor, an adhesive member placed on the protective layer, and a ceramic layer placed on the adhesive member, wherein the edge of the ceramic layer, the edge of the adhesive member, and the edge of a part of the protective layer include machined surfaces. Other embodiments are also possible.

公开(公告)号：US20190266381A1

公开(公告)日：2019-08-29

申请号：US16282657

申请日：2019-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungseon HWANG ,  Deokhee LEE ,  Sunggyu LEE

IPC: G06K9/00 ,  G06F1/16 ,  H01L23/29 ,  B32B27/16 ,  H01L23/00

Abstract: An electronic device is provided. The electronic device includes a fingerprint sensor including a sensor having a surface including epoxy molding compound (EMC) resin, a first layer disposed on the surface of the sensor or above the surface of the sensor, and a second layer disposed on the first layer or above the first layer. The first layer includes a first ultraviolet (UV) hardening material having first hardness. The second layer includes a second UV hardening material having second hardness greater than the first hardness and a surface of the second layer has surface roughness less than a specified value.