公开(公告)号：US20250062177A1

公开(公告)日：2025-02-20

申请号：US18623860

申请日：2024-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Min LEE ,  Sang-Sick PARK ,  Un-Byoung KANG ,  Ku Young KIM

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a second semiconductor chip on the first semiconductor chip, an upper pad on an upper surface of the first semiconductor chip, a lower pad on a lower surface of the second semiconductor chip that faces the upper surface of the first semiconductor chip, a connecting bump between the upper pad and the lower pad, a lower film on the upper surface of the first semiconductor chip, and on a side surface of the upper pad and an upper film between the lower film and the lower surface of the second semiconductor chip, and on a side surface of the lower pad, wherein the lower film includes a thermosetting material, the upper film includes a photocurable material, and a side surface of the lower film protrudes outward beyond a side surface of the first semiconductor chip.