公开(公告)号：US20190091833A1

公开(公告)日：2019-03-28

申请号：US15957012

申请日：2018-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sol HAN ,  Yung Jun KIM ,  Ho Young KIM ,  Doo Sik MOON ,  Sung Oh PARK ,  Young Seok JANG ,  Sun Gyu PARK ,  Kyu Min OH ,  Joo Han LEE

IPC: B24B53/017 ,  B24B37/005 ,  H01L21/306

Abstract: A chemical mechanical polishing method includes providing a pad conditioner, such that the pad conditioner includes a base and a plurality of tips protruding from a surface of the base, adjusting a surface roughness of an upper surface of each tip of the plurality of tips, and adjusting a polishing rate of chemical mechanical polishing using the adjusted surface roughness of the upper surfaces of the plurality of tips.