公开(公告)号：US20240079437A1

公开(公告)日：2024-03-07

申请号：US18505392

申请日：2023-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KangMook LIM ,  Dae Hoon KIM ,  Seung Sik KIM ,  Ji-Youn SONG ,  Jae Hoon JEON ,  Dong Seok CHO

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14603 ,  H01L27/14621 ,  H01L27/14627

Abstract: An image sensor includes a plurality of unit pixels, each including: a substrate including first and second sides which are opposite to each other, a photoelectric conversion layer in the substrate, and a wiring structure on the first side of the substrate. The wiring structure may include: a first capacitor, a second capacitor spaced from the first capacitor, a plurality of edge vias arranged along edges of the unit pixel, and a plurality of central vias interposed between the first capacitor and the second capacitor.

公开(公告)号：US20210327930A1

公开(公告)日：2021-10-21

申请号：US17128362

申请日：2020-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KangMook LIM ,  Yeo Seon CHOI ,  Sung In KIM ,  Chang Hwa KIM

IPC: H01L27/146

Abstract: An image sensor includes a substrate which includes a plurality of unit pixels. Each of the plurality of unit pixels includes a photoelectric conversion layer. A pixel separation pattern is disposed in the substrate and has a and shape that includes a plurality of grid points. The pixel separation pattern is configured to separate each of the plurality of unit pixels from each other. A support structure is disposed in the substrate and is positioned to correspond to the plurality of grid points of the pixel separation pattern. The support structure is configured to support adjacent unit pixels of the plurality of unit pixels.