公开(公告)号：US20130313714A1

公开(公告)日：2013-11-28

申请号：US13837891

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Hyun SEOK ,  Do Hyung KIM ,  Kwang Seop KIM

IPC: H01L23/50

CPC classification number: H01L23/50 ,  G11C5/04 ,  G11C5/063 ,  H01L27/1052 ,  H01L2924/0002 ,  H05K1/0248 ,  H01L2924/00

Abstract: A semiconductor includes a first signal line commonly connected to a plurality of semiconductor devices and a second signal line commonly connected to one or more of the plurality of semiconductor devices. The first signal line has a first impedance per unit length, the second signal line has a second impedance per unit length, the second impedance per unit length is greater than the first impedance per unit length, and the first signal line has a longer routing length than the first signal line. Widths of the signal lines may be set to reduce a difference in the impedances.

Abstract translation: 半导体包括共同连接到多个半导体器件的第一信号线和共同连接到多个半导体器件中的一个或多个的第二信号线。 第一信号线具有每单位长度的第一阻抗，第二信号线具有每单位长度的第二阻抗，每单位长度的第二阻抗大于每单位长度的第一阻抗，并且第一信号线具有较长的路由长度 比第一条信号线。 可以设置信号线的宽度以减小阻抗的差异。