公开(公告)号：US11171082B2

公开(公告)日：2021-11-09

申请号：US16661345

申请日：2019-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihoon Kim ,  Mijin Park ,  Jinwon Lee

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L23/13 ,  H01L23/00

Abstract: A semiconductor package includes: a connection structure including a plurality of insulating layers and redistribution layers respectively disposed on the plurality of insulating layers; a semiconductor chip having connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip; first and second pads arranged on at least one surface of the connection structure and each having a plurality of through-holes; a surface mount component disposed on the at least one surface of the connection structure and including first and second external electrodes positioned, respectively, in regions of the first and second pads; first and second connection vias arranged in the plurality of insulating layers and connecting the first and second pads to the redistribution layers, respectively; and first and second connection metals connecting the first and second pads and the first and second external electrodes to each other, respectively.